New technology-based MCU samples to be available in the second half of 2024… Full-scale production in the second half of 2025
18nm FD-SOI with ePCM for dramatic improvement in price competitiveness, performance, and power consumption

STMicroelectronics (hereinafter referred to as ST) has disclosed the process technology jointly developed with Samsung Foundry.

STMicroelectronics today announced an advanced process based on 18nm FD-SOI (Fully Depleted Silicon On Insulator) technology featuring embedded Phase Change Memory (ePCM) to support next-generation embedded processing devices.

Jointly developed by ST and Samsung Foundry, this new process technology enables greater memory capacity and greater integration of analog and digital peripherals while increasing price competitiveness for performance and power consumption in embedded processing applications.

The first next-generation STM32 MCUs based on this new technology are scheduled to sample to selected customers in the second half of 2024, with full production scheduled for the second half of 2025.

Compared to the ST 40nm eNVM (embedded Non-Volatile Memory) technology currently in use, 18nm FD-SOI with ePCM significantly improves key performance.

18nm FD-SOI offers over 50% improvement in performance per power and 2.5x higherIt enables implementation of larger on-chip memory with NVM (Non-Volatile Memory) density.

It also supports the integration of digital peripherals such as AI and graphics accelerators, as well as cutting-edge security and safety features, with 3x higher digital density, and improves the RF performance of wireless MCUs with a 3dB improved noise figure.

This technology can operate at 3V and provides analog functions such as power management, reset system, clock source, and digital/analog converter, making it the only sub-20nm technology to support this performance.

Additionally, it provides the reliability required for demanding industrial applications with robust high-temperature operation, radiation hardening, and data retention capabilities proven in automotive applications.

“As a leading semiconductor innovator, ST has developed and offered our customers FD-SOI and PCM technologies to support automotive and aerospace applications,” said Remi El-Ouazzane, President of ST’s MCU, Digital IC and RF Products Group. “Now, with the next-generation STM32 MCUs as the starting point, we are taking the next step and making the benefits of these technologies available to industrial application developers.”