SK하이닉스가 이전 세대보다 60% 이상 빠른 32Gbps(초당 32기가비트)의 동작속도를 구현한 GDDR7을 공개했다.
Compared to previous models, operating speed is 60% faster and power efficiency is 50% higher
Processing data equivalent to 300 FHD movies in 1 second
SK Hynix continues its technological leadership in high-performance graphics memory.
SK Hynix unveiled GDDR7, a next-generation graphics memory product with world-class performance, on the 30th.
GDDR (Graphics DDR) is the standard specification name for graphic DRAM specified by the Joint Electron Device Engineering Committee (JEDEC). It is a specification specialized for fast graphic processing, and is changing from generation to generation in 3-5-5X-6-7. The latest generation has faster speeds and higher power efficiency, and has recently been attracting attention as a high-performance memory that is widely used in the AI field beyond graphics.
SK Hynix stated, “Global AI customers are showing increasing interest in GDDR, a DRAM that simultaneously satisfies performance specialized for graphic processing and fast speed,” and “In response, we completed development of the highest performing GDDR7 in March and have now released it, and plan to begin mass production in the third quarter.”
SK Hynix's GDDR7 has been confirmed to have an operating speed of 32 Gbps (32 gigabits per second), which is 60% faster than the previous generation, and the speed can increase up to 40 Gbps depending on the usage environment.
This product is equipped with the latest graphics card and can process more than 1.5TB (terabytes) of data per second, which is equivalent to processing data equivalent to 300 FHD (Full-HD) movies (5GB) in just one second.
In addition, GDDR7 offers fast speeds while improving power efficiency by over 50% compared to the previous generation. To achieve this, SK Hynix introduced a new packaging technology during the product development process that solves the heat generation problem caused by ultra-high-speed data processing.
The company's engineers increased the number of heat dissipation substrates applied to the package from four to six layers while maintaining the product size, and applied high-heat dissipation EMC as the packaging material. Through this, the engineers succeeded in reducing the product's thermal resistance by 74% compared to the previous generation.
SK hynix Vice President Lee Sang-kwon (in charge of DRAM PP&E) said, “SK hynix’s GDDR7, which boasts the highest performance among current graphic memories with overwhelming speed and power efficiency, will expand its application range to not only high-end 3D graphics but also AI, high-performance computing (HPC), and autonomous driving.” He added, “Based on our outstanding technological competitiveness, we will further strengthen our premium memory lineup and solidify our position as the most trusted AI memory solution company by customers.”