The Korea Institute of Machinery and Materials (President Ryu Seok-hyun) and the Nano Convergence Technology Institute (President Park Heung-soo) have joined hands to build a 300mm semiconductor advanced packaging infrastructure and develop technology.

On the 1st, the Korea Institute of Machinery and Materials signed a business agreement with the Nano-Cell Technology Institute at the Daejeon headquarters to strengthen mutual cooperation and exchange in the establishment of advanced semiconductor packaging infrastructure and technology development.

Through this agreement, the two organizations will open the door to cooperation in areas such as the Ministry of Science and ICT's 'Establishment of Advanced Semiconductor Packaging Infrastructure' project and the establishment of a next-generation semiconductor advanced packaging R&D platform.

The main contents of the agreement are: △Cooperation in joint research and development of next-generation core technologies related to materials, parts, and equipment in the semiconductor advanced packaging field and in corporate technology support; △Cooperation in infrastructure advancement such as equipment construction and utilization and process technology development in the semiconductor advanced packaging field.

Nano-Chonggiwon will establish an open advanced packaging R&D line, and the Korea Institute of Machinery and Materials will share the materials and component technology, while the Korea Institute of Machinery and Materials will share the equipment technology to establish a three-dimensional technology support system for advanced packaging small and medium-sized enterprises. Nano-Chonggiwon will also plan and promote an advanced packaging R&D program that links the infrastructure of Nano-Chonggiwon and the development equipment of the Korea Institute of Machinery and Materials.

Ryu Seok-hyun, the president of the Korea Institute of Machinery and Materials, said, “This business agreement is a result of the cooperation between Nano-Center, which has supported the creation of new industries by semiconductor material and component companies, and the world-class equipment technology. He said, “This is an opportunity for the Korea Institute of Machinery and Materials, which has been leading the way, to establish a new level of cooperation model,” and added, “We hope that the two organizations will pool their technological capabilities to support domestic semiconductor packaging small and medium-sized companies to become globally competitive, and that our semiconductor industry will be able to open a new chapter in the development of advanced packaging technology.”

Park Heung-soo, president of the Nano Comprehensive Technology Institute, said, “The Nano Comprehensive Technology Institute and the Korea Institute of Machinery and Materials have been continuously collaborating for the past 20 years in nano-process and equipment development along with the establishment of nanofabs.” He continued, “This business agreement is significant in that it lays the foundation for technological cooperation in the field of advanced packaging to strengthen national competitiveness and the semiconductor ecosystem, and for supporting domestic small and medium-sized enterprises. I hope that this will be the starting point for both organizations to pioneer new fields and develop together.”