Recently, as the AI packaging market is experiencing difficulties in the global supply chain due to the oligopoly of Taiwanese companies, Nepes is developing the next-generation packaging PoP (Package on Package) technology required for artificial intelligence (AI) and advanced semiconductors and is working with domestic and foreign chip manufacturers to commercialize it.

Nepes announced on the 20th that it has completed the development of PoP technology, the foundation technology of 2.5D packaging, by utilizing its strength in redistribution (RDL) technology, and is currently pursuing commercialization.

2.5D packaging is a technology that horizontally matches semiconductor dies on a wide substrate-shaped interposer, and is mainly used to integrate AI semiconductors and HBM (High Bandwidth Memory) into a single package.

The 2.5D packaging being developed by Nepes has the advantages of price competitiveness and small form factor by implementing a redistribution (RDL) interposer using a fan-out process instead of an expensive silicon (Si) interposer.

In particular, the PoP technology developed this time includes element technologies such as semiconductor element embedding technology, double-sided redistribution (RDL) technology, and vertical interconnection, and is used in smartphones and automobile APs (Application Processors), wearable sensors, and It is a basic platform technology for advanced packaging that can expand its use to AI semiconductors, etc.

“We have received certification for our excellent performance from a Japanese global semiconductor company that manufactures LiDAR sensors, a key technology for autonomous vehicles, and are currently in discussions to apply our products to them,” said Jong-Heon Kim, CTO of Nepes. “In the meantime, we are actively discussing commercialization for use in medical equipment and hearing aids for customers in the U.S. and Europe.”

Director Kim Jong-heon continued, “Based on the PoP technology we have developed this time, we are focusing on 2.5D packaging technology for AI semiconductors, and we aim to complete development with customers in the first half of 2025 and begin mass production in the second half of the year.”

Nepes is a strategic market that will drive next-generation growth, and the company has set a goal of actively collaborating with customers of AI servers, automobiles, and edge computing products to fully commercialize 2.5D and PoP technologies from the second half of 2025.

Meanwhile, e4ds news will host the ' 2024 e4ds Semiconductor Packaging Day ' on Tuesday, May 28th to look at the latest semiconductor packaging technology. This seminar will introduce cutting-edge technologies along with the strategies of major companies in advanced packaging along with the semiconductor market trends in 2024. Registration is available on the e4ds news homepage ( https://www.e4ds.com/seminar_introduce.asp?idx=142 ).