산업과 제품 전반에 ST MCU의 사용이 보편화되고 있다. 온디바이스 AI의 유행과 차세대 기술의 구현, 기능 안전과 사이버 시큐리티 트러스트와 같은 새로운 글로벌 규제에 대응하는 등 개발자 편의성 제공이 글로벌 칩 메이커의 핵심 가치로 떠오르고 있다.

▲STM32 Summit On Tour Korea
Portfolio, Ecosystem, Manufacturing, Accessibility Core
Next-generation 18nm FD-SOI process to be launched next year
IAR Partners, “Combining Functional Safety and Security”
ST MCUs are becoming more widespread across industries and products. Providing developer convenience is emerging as a core value for global chipmakers, as they respond to the trend of on-device AI, implementation of next-generation technologies, and new global regulations such as functional safety and cybersecurity trust.
The 'STM32 Summit On Tour Korea (hereinafter referred to as the STM32 Summit)' hosted by STMicroelectronics was held on the 3rd at Yangjae El Tower. The event introduced various STM32 product families, revealed roadmaps, and success stories of partners utilizing ST product families.
In the keynote speech, Ricardo, Vice President and General Manager of STMicroelectronics' General-Purpose MCU, Digital IC, and RF Group, took the podium. Vice President Ricardo cited four key aspects of STM32: broad product portfolio, ecosystem, manufacturing capabilities, and user accessibility.
“With over 3,000 STM32 products and over 600 new products planned for 2023,” said VP Ricardo, emphasizing product diversity. “To enhance developer convenience and accelerate product delivery, we are creating an ecosystem with over 1 million developers using all boards, tools, and software.”
In addition, ST is said to have a flexible supply chain through its own fabs and collaboration with external foundry partners, and to continue to invest heavily in this. It is said that more than 300,000 people visit the STM32 community every month.

▲Vice President Ricardo explains STM32’s extensive product portfolio.
VP Ricardo said that ST’s cutting-edge products will be mass-produced using the next-generation 18nm FD-SOI process, and that compared to the existing 40nm process, it is expected to have the following effects: △Implementation of a low-power structure with a 50% improvement in power consumption, △2.5 times improvement in memory density, △3 times increase in digital density, △3 dB reduction in RF noise, and △Increase in Bluetooth long-distance communication efficiency.
ST is currently conducting pilot tests with customers on its 18nm FD-SOI process, and expects to begin mass production next year after completing testing in the fourth quarter. This is a new process technology jointly developed with Samsung Foundry, and is expected to realize a next-level increase in power efficiency for embedded processors.
On this day, YouTuber ‘Baram’, famous for his maker activities including IAR, participated in the event and shared solutions and development cases utilizing STM32. ST introduced product series such as △STM32WBA △STM32MP2 △STM32H7R/S as well as △TouchGFX △ST Edge AI Suite, etc.
Manager Moon Hyun-soo said, “ST has focused on edge AI and has accumulated technology and know-how for 10 years,” and “STM32 is a platform optimized for edge AI and is being adopted in industries, home appliances, mobile devices, etc. around the world.”
“As the complexity of functional safety and security solutions has increased, customers’ concerns have also deepened,” said Young-Hoo Lee, IAR’s technical support manager who participated in the partnership. “By combining the STM32 with IAR’s software package that enhances functional safety and security, customers can achieve stable time-to-market and functional safety.”