EV Group (EVG), a provider of innovative process solutions and expertise in advanced semiconductor design and chip integration, will present its technology to the public at SEMICON Korea 2025 to address future demands for chip stacking.

EVG announced that it will showcase its wafer bonding and lithography technologies, including its IR LayerRelease™ temporary bonding and debonding (TB/DB) solution, at SEMICON Korea 2025, taking place February 19-21 at COEX in Seoul.

As a leader in wafer bonding markets and technologies, EVG offers the most comprehensive wafer bonding solutions, including TB/DB solutions that support the development and production of HBM and 3D DRAM, key components of AI accelerators and high-performance computing (HPC).

SEMICON Korea is considered one of the world's leading semiconductor technology exhibitions, with key topics including AI, advanced packaging, and sustainable semiconductor manufacturing.

“Accelerating the development and mass production of next-generation HBM and 3D DRAM is a top priority for the Korean semiconductor industry,” said Dr. Thorsten Matthias, EVG’s Asia Pacific sales director. “EVG’s IR LayerRelease technology enables thinner die, higher stacking of HBM, and eliminates the need for mechanical debonding. Additionally, IR LayerRelease supports both current and next-generation stacked memory processes by replacing mechanical debonding processes while supporting the use of silicon carriers. It also provides front-end compatibility and can be combined with fusion and hybrid bonding processes, making it ideal for ultra-thin wafer and film processing,” he explained.

HBM and 3D DRAM are emerging as promising semiconductor technologies to meet the demands of AI learning applications. TB/DB is a key chip stacking process essential to manufacturing these advanced memory chips.

Conventional mechanical debonding methods do not provide sufficient precision for ultra-thin wafers with very complex designs, such as next-generation HBM.

EVG’s IR LayerRelease solution provides clear advantages to memory semiconductor and other device manufacturers worldwide in terms of precision, higher yields, lower cost of ownership, environmental impact, and future readiness.

IR LayerRelease replaces traditional mechanical debonding and strengthens EVG’s portfolio of debonding technologies, along with slide-off and UV laser debonding solutions based on the EVG®850 platform.

IR LayerRelease is a fully front-end compatible layer release technology that uses an infrared (IR) laser with a wavelength that is transparent to silicon. When used with specially formulated inorganic layers, it can separate ultra-thin films or layers from silicon carriers with nanometer precision, providing industry-leading debonding throughput.

IR LayerRelease eliminates the need for glass carriers in advanced packaging processes and enables new process flows for 3D IC applications.

Ultra-thin layers on silicon carriers are also capable of hybrid and fusion bonding. Minimize the ecological and environmental impact of semiconductor fabs by using inorganic solvents instead of organic solvents in post-cleaning operations. The cleaning process can be integrated into the EVG®880 equipment, a fully automated mass production platform.

EVG will present process solutions for AI, HPC, advanced packaging, and sustainable semiconductor manufacturing at SEMICON Korea 2025, held at COEX in Seoul from February 19 to 21. Visit the EVG booth (C740, Hall C, 3rd floor) to see the innovative technologies and solutions firsthand.