Microchip Technology Inc. (Nasdaq: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that it has achieved the highest level of certification for space components, demonstrating superior product reliability and longevity.

Microchip Technology Inc. today announced that its radiation-tolerant RTG4™ field programmable gate array (FPGA) manufactured with lead-free flip-chip bump technology has achieved Qualified Manufacturers List (QML) Class V status to meet mission assurance requirements for the most critical space programs.

The QML Class V rating, designated by the Defense Logistics Agency (DLA) under the U.S. Department of Defense, is the highest level of certification for components used in the space industry and is an essential certification level required for critical space missions such as manned space exploration, deep space exploration, and national security.

Because QML certification is standardized based on specific performance and quality requirements set by DLA, customers can further streamline their design and certification processes by using QML certified products.

RTG4 FPGA is the first RT FPGA with over 150,000 logic elements to achieve QML Class V certification in 2018., the next-generation solution that applies lead-free flip-chip bump technology launched this time is the first in the industry to achieve QML Class V certification.

Advanced flip-chip package structures, such as those used in RTG4 FPGAs, use flip-chip bumps to connect the silicon die to the package substrate.

Lead-free bump material helps extend the life of the product, which is critical for space missions.

“The RTG4 FPGA represents a significant achievement and milestone for Microchip in providing customers designing spaceflight systems with high reliability, robustness without configuration errors and efficient low-power consumption,” said Bruce Weyer, vice president of Microchip’s FPGA business unit. “Microchip has been providing solutions for spaceflight missions for more than 60 years and is committed to providing longevity and best-in-class quality solutions.”

RTG4 FPGAs are designed to provide high-density, high-performance for space applications, with low power consumption and robustness to configuration errors, reducing cost and design effort.

Unlike SRAM-based FPGAs, RTG4 FPGAs use very little static power, helping to manage thermal issues that frequently occur on spacecraft. RTG4 FPGAs consume much less power than SRAM FPGAs, and do not require additional radiation protection measures because they do not experience configuration errors when exposed to radiation environments. This can reduce design costs and overall system costs.

To achieve QML Class V certification, RTG4 FPGAs with lead-free flip-chip bumps underwent rigorous reliability testing, including up to 2,000 thermal cycles at temperatures ranging from -65°C to 150°C.

The lead-free flip chip bump interface passed the MIL-PRF-38535 test standard and exhibited no tin whiskers.

Because these flip-chip bumps are internal to the FPGA package, the transition to lead-free bumped RTG4 FPGAs does not impact existing user design approaches, reflow profiles, thermal management, or board assembly processes.

Microchip offers the industry’s most comprehensive portfolio of space products, including radiation-hardened and tolerant solutions. This includes QML Class Q RT PolarFire® FPGAs and sub-QML FPGAs that bridge the component gap between traditional Qualified Manufacturers List (QML) parts and Commercial Off-The-Shelf (COTS) parts. A complete list of Microchip FPGA and mixed-signal part numbers and their corresponding Defense Landlord (DLA) drawing numbers can be found in the DLA Cross-Reference Guide.