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SKT and SK Broadband Introduce 800Gbps High-Capacity Wired Network
SK Telecom (CEO Yong Sang Yoo) has proactively responded to the surge in data traffic from AI, cloud, and 5G by introducing 800Gbps-class high-capacit..
2024.09.04 by 배종인 기자
Vertiv, LS Materials Join Hands for Data Center Energy Solutions
Vertiv Korea has signed a strategic memorandum of understanding (MOU) with LS Materials, a leader in domestic ultracapacitor (UC) battery technology, ..
2024.09.04 by 배종인 기자
Samsung Electronics to Equip Intel Chips with Copilot Plus Support
Samsung Electronics is launching the Galaxy Book5 Pro 360 equipped with Intel Lunar Lake, which supports Copilot Plus with up to 47 TOPS NPU, and expe..
2024.09.04 by 배종인 기자
SK Ecoplant, Full-scale Attack on Industrial Gas Market
SK Ecoplant is incorporating SK Materials Air Plus as a subsidiary, marking the beginning of full-scale entry into the industrial gas market.
2024.09.04 by 배종인 기자
STM32 Summit held in Korea...STM32, the strength of 1 million developer ecosystem
The use of ST MCUs is becoming widespread across industries and products. Providing developer convenience is emerging as a core value for global chip ..
2024.09.04 by 권신혁 기자
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Machine tool 'arms and legs' drivetrain technology, free from overseas dependence worth 300 billion won per year
The Korea Electrotechnology Research Institute (KERI) has successfully achieved the localization and development of 'drive system for CNC systems' tec..
2024.09.04 by 배종인 기자
ETRI develops 8-photon qubit chip for quantum computing
The Electronics and Telecommunications Research Institute (ETRI) has completed a system capable of controlling 8 photons by expanding its silicon phot..
2024.09.04 by 배종인 기자
“SK Hynix to launch HBM4 12-layer in 2025”
Lee Kang-wook, Senior Vice President of SK Hynix (in charge of PKG Development), delivered a presentation at SEMICON TAIWAN on the 3rd with the theme ..
2024.09.04 by 배종인 기자
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Hexagon, 'Hexagon DX Executive Forum' Completed
Hexagon Manufacturing Intelligence, a global leader in digital reality solutions combining sensors, software, and autonomous technologies, shared glob..
2024.09.03 by 배종인 기자
“The wheel shape changes depending on the road obstacles”
The Korea Institute of Machinery and Materials (KIMM, Director Ryu Seok-hyun) under the Ministry of Science and ICT has successfully developed a morph..
2024.09.03 by 배종인 기자
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“SDV SW Complexity Management Framework Core”
An expert has argued that for SDV success, a software factory is needed to interconnect an enormous amount of code, catch errors within it, test and d..
2024.09.02 by 배종인 기자
“Magnetic Package, Heat, Power, EMI Advantages...Designer Inductor Concerns↓”
Size issues play a significant role in power design. In response, magnetic packaging (MagPack) technology has been unveiled, which can enhance EMI adv..
2024.09.02 by 권신혁 기자