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Samsung Electronics to mass produce 36GB HBM3E 12-layer stacked DRAM in the first half of the year
Samsung Electronics has succeeded in developing the industry's first 36GB HBM3E (5th generation HBM) 12H (High, 12-layer stacking) DRAM and is moving ..
2024.02.28 by 배종인 기자
LG Uplus, AWS, and Samsung Electronics to Automatically Adjust 5G Equipment Capacity Using AI
LG Uplus announced on the 27th that it will collaborate with Amazon Web Services (AWS) and Samsung Electronics at the Mobile World Congress 2024 (MWC ..
2024.02.27 by 김예지 기자
Intel Unveils Edge Platform, Simplifying On-Device AI Development
Competition among companies is intensifying to expand AI at the edge device layer that interfaces with consumers and end users. In this context, Intel..
2024.02.27 by 명세환 기자
AMD Radeon RX 7900 GRE Graphics Card Worldwide Launch
AMD has unveiled a new graphics card equipped with an AI accelerator, designed for 4K resolution gaming and streaming.
2024.02.27 by 명세환 기자
Breakthrough in the Semiconductor War as Government and Companies Unite
The Ministry of Industry, Trade and Resources (Minister Ahn Deok-geun) discussed countermeasures with semiconductor industry leaders to proactively re..
2024.02.27 by 배종인 기자
SKT Establishes 'Telco AI Alliance (GTTA)' with Global Telecommunications Companies
SKT has joined a global AI alliance with major telecommunications companies to drive AI technology innovation and lead the industry. Yoo Young-sang, p..
2024.02.27 by 김예지 기자
Huawei, “5.5G commercialization in 2024”
Huawei held the '5G Beyond Growth Summit' on the 26th at MWC 2024 taking place in Barcelona, Spain. President Li Peng asserted that "5.5G will enter f..
2024.02.27 by 김예지 기자
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ADLINK Launches 5G IIoT Gateway for Edge Networks
ADLINK Technology announced on the 26th that it is launching a new MXA-200 Arm-based 5G IIoT gateway equipped with a 1.6GHz NXP i.MX 8M Plus quad Arm ..
2024.02.27 by 김예지 기자
Newland Korea Launches Wireless Specialized Industrial Hand Barcode Scanner 'NVH220B'
Newland Korea (CEO Sung Tae-ho) supplies the wireless industrial hand barcode scanner 'NVH220B' to the Korean market, significantly enhancing work pro..
2024.02.26 by 배종인 기자
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Nepes begins mass production of advanced PMIC packaging
Semiconductor backend processing company Nepes has recently begun receiving orders for power semiconductors for artificial intelligence (AI) chipsets ..
2024.02.26 by 배종인 기자
NVIDIA to hold GTC 2024...offline for the first time in 5 years
GTC, held in the heart of Silicon Valley, is establishing itself as a collaborative platform that goes beyond technical presentations to share knowled..
2024.02.26 by 명세환 기자
ST Expands 3D Depth Sensing Solutions with Latest ToF Sensor
ST announced on the 26th the introduction of an industry-leading integrated dToF (direct Time-of-Flight) 3D lidar module with 2.3k resolution, and dis..
2024.02.26 by 성유창 기자