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KT to participate in 2021 'Metaverse' Smart Country Expo online
The Smart National Territory Expo, now in its 13th edition this year, will be held for three days from the 21st to the 23rd on a metaverse-based onlin..
2021.07.20 by 명세환 기자
Korea Institute of Machinery and Materials (KIMM) excels in AI safety diagnosis
The Korea Institute of Machinery and Materials is demonstrating excellent performance in monitoring the condition of equipment and structures across v..
2021.07.19 by 배종인 기자
Materials Research Institute Uses AI to Identify Ultra-Fine Defects
The research team led by Dr. Kang Sung-hun at the Materials Artificial Intelligence and Big Data Research Center of the Korea Institute of Materials S..
2021.07.19 by 배종인 기자
Samsung Selects 12 Support Projects for 2021, Including AI and Semiconductor Devices
Samsung Electronics has selected 12 research support projects in areas including AI and semiconductor devices for 2021 and will provide approximately ..
2021.07.19 by 배종인 기자
[China Briefing] China's Three Major Cloud Companies Develop In-House Chips
e4ds News Summary of ICT News from Greater China - July 19, 2021 [China Briefing]: ◇"Developing Cloud-Dedicated Chips" Baidu-Alibaba-Tencent Actively ..
2021.07.19 by 이수민 기자
Dutch Government Halts ASML EUV Equipment Exports to China: "Why?"
ASML, the world's second-largest semiconductor equipment manufacturer, is facing restrictions on EUV equipment exports to China due to a hold on autho..
2021.07.19 by 이수민 기자
"Will a mobile AlphaGo come out?" KAIST develops high-efficiency AI semiconductor
Professor Yu Hoe-jun's team at KAIST announced that they have developed semiconductor technology capable of processing deep reinforcement learning (DR..
2021.07.16 by 이수민 기자
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[China Briefing] TSMC to Increase MCU Production by 60% This Year
e4ds News China-Taiwan-Hong Kong ICT News Digest - July 16, 2021 [China Briefing]: ◇TSMC Revises Annual Growth Rate, Forecasts Resolution of Automotiv..
2021.07.16 by 이수민 기자
Congatec Launches Durable 11th Gen Intel Core-Based COM
Congatec Korea has launched 'conga-TC570r COM Express,' a new computer-on-module (COM) product based on 11th generation Intel Core processors with enh..
2021.07.16 by 강정규 기자
Quickso-ST Accelerates IoT Device Development with ML-Enabled Motion Sensors
The ST MLC sensor reduces overall system power consumption by executing sensing-related algorithms on the detected data set independently, rather than..
2021.07.16 by 강정규 기자
[China Briefing] US to Support Huawei Equipment Replacement Costs
e4ds News China ICT News Roundup - July 15, 2021 [China Briefing]: ◇US FCC Unanimously Approves Telecom Carrier Support for Huawei Equipment Replacem..
2021.07.15 by 이수민 기자
Xilinx Introduces 'Versal HBM ACAP' Integrated with HBM2E DRAM
Real-time, high-performance applications experience bottlenecks due to memory bandwidth and can operate at the boundary of power and thermal limits. I..
2021.07.15 by 이수민 기자