전체기사2,434건
[Special Report] Robot Design Overcomes 'Physical SOC' Limitations: Dabo Executive Vice President Yong-gyu Cho Reveals Infineon's Robotics Systems Philosophy
Jo Yong-gyou, Executive Director at DABO, emphasized a design philosophy centered on system-level approaches rather than individual components through..
2026.03.12 by 명세환 기자
NXP Launches CoreRide Z248, Optimized for 48V Zone Architecture
NXP Semiconductor unveiled CoreRide Z248, a new zone-based system for automotive manufacturers, on March 12th. This system integrates 48V power distri..
2026.03.12 by 배종인 기자
Vector and Microchip Unveil Integrated Solution for Small ECUs, Easing the Initial Burden of SDV Development
With the proliferation of Software-Defined Vehicles (SDV), vehicle control architecture is being restructured around high-performance central computin..
2026.03.12 by 명세환 기자
AI is transforming science and technology… The "K-Moonshot" initiative is in full swing.
The large-scale national project "K-Moonshot" aimed at elevating the nation's science and technology competitiveness through artificial intelligence (..
2026.03.12 by 배종인 기자
[Deep Dive] MCU Sheds Its "Control" Shell and Embraces "Intelligence": A Major Transition to an Edge AI Platform
Today, the biggest topic facing embedded systems designers is undoubtedly 'AI'. However, many edge devices surrounding us—refrigerators, door locks, i..
2026.03.12 by 명세환 기자
.jpg)
NVIDIA Defines AI as a "Five-Layer Cake" and Releases a Blueprint for Next-Generation AI Infrastructure Transformation
Nvidia has defined AI as core infrastructure comprising a "5-tier cake" structure composed of energy, chips, infrastructure, models, and applications...
2026.03.11 by 배종인 기자
MPS, “‘MPM3695 Family’ Meets High-Current, Low-Voltage Power Supply Design Demands”
MPS Technical Support Director Jung Tae-hoon discusses integrated power modules for high-current power design, a new approach to flexible output volta..
2026.03.11 by 편집부
congatec Expands its Intel Core Series 2-Based COM-HPC Modules
As real-time control and parallel data processing demands grow in industrial environments, the role of high-performance edge computing modules is expa..
2026.03.11 by 명세환 기자
TI Usheres in the Era of "Edge AI for Every Device" with TinyEngine™ NPU-Integrated MCUs
Texas Instruments (TI) held an online press briefing on the 11th, introducing the TinyEngine™ NPU-integrated MCU to be showcased at Embedded World 202..
2026.03.11 by 배종인 기자
Catenoid Launches No-Code Short-Form Widget, Simplifying Video Commerce Implementation on Its Own Mall
Catenoid has added a 'shortform widget' feature to its no-code shortform video platform 'Charlla'. The feature is designed to allow users to arrange s..
2026.03.11 by 명세환 기자
NXP Unveils 'i.MX 93W', Integrating AI, Wireless, and Security, Targeting Edge-Based Physical AI Expansion
NXP Semiconductors has unveiled the i.MX 93W application processor, which integrates AI computing, wireless connectivity, and security functions into ..
2026.03.11 by 배종인 기자
Infineon aims to achieve 23.2% MCU market share by 2025, expanding into the automotive and robotics markets.
Infineon recorded a 23.2% market share in the global microcontroller (MCU) market in 2025. This represents an increase of 1.8 percentage points from 2..
2026.03.11 by 배종인 기자