전체기사2,521건
[2025 Power Electronics Conference] Teledyne LeCroy Director Chang-Hoon Oh, “Perfect Support for Noise Ripple, Motor Efficiency, and Double Pulse Testing”
Teledyne Lecroy participated in the 2025 Power Electronics Academic Conference held at the Pyeongchang Alpensia Convention Center from July 7 to 10, a..
2025.07.22 by 배종인 기자
[2025 Power Electronics Conference] Nubicom Vice President Kim Ki-ryong, “NI presents a solution for data center power monitoring in the AI era”
Nubicom, the domestic distributor of National Instruments (NI), participated in the 2025 Power Electronics Academic Conference held at the Alpensia Co..
2025.07.22 by 명세환 기자
[2025 Power Electronics Conference] Tektronix Director Shin Ji-in, “High-Precision and Stable Analysis of Noise in AI Data Centers, Motors, Inverters, and Power Semiconductors”
Global test and measurement equipment specialist Tektronix participated in the '2025 Power Electronics Academic Conference' and garnered significant a..
2025.07.22 by 배종인 기자
“On-device AI requires a lightweight AI model, system software stack, and AI hardware.”
Kwon Jin-se, a researcher at the On-Device AI Research Division of the Electronics and Telecommunications Research Institute (ETRI), presented "On-Dev..
2025.07.21 by 배종인 기자
“Korea’s Key Technology Self-Reliance through Large-Scale Investment in Physical AI Is Essential”
Lee Hae-su, Senior Researcher at the AI Policy Research Division of the Software Policy Research Institute, presented on "Physical AI Development Tren..
2025.07.21 by 명세환 기자
NI·Nubicom, Full-scale Industry-Academic Cooperation for Future Industries
Global measurement and automation specialist NI (National Instruments) and its domestic distributor Nubicom have signed a Memorandum of Understanding ..
2025.07.21 by 배종인 기자
Lee Chang-yeol, Chairman of KESSIA, “We will actively support preemptive response to the convergence of AI technology and physical systems”
The Embedded Software and System Industry Association (Chairman Lee Chang-yeol, hereinafter KESSIA) held a seminar titled "Latest Embedded Technology ..
2025.07.18 by 명세환 기자
“Tekla Powerfab, Digital Innovation in Steel Fabrication Industry, Simultaneously Achieving Profitability Enhancement and Quality Innovation”
Trimble, a global leader in 3D BIM, held a press briefing on the 17th at Lotte City Hotel in Guro and presented an overview of Tekla PowerFab, the nat..
2025.07.17 by 배종인 기자
Vector's secure middleware technology and QNX's secure certified operating system combine
Vector Korea, a global software company specializing in the development of electronic systems for automobiles, aerospace, and transportation, announce..
2025.07.17 by 배종인 기자
AMD, “Ryzen Threadripper PRO 5th Anniversary Sets New Standard for Workstations”
AMD Ryzen Threadripper PRO series, marking its fifth anniversary since launch this year, once again demonstrated its solid position in the workstation..
2025.07.15 by 배종인 기자
Siemens Drives CAD Innovation with AI Copilot and Immersive Design, Announces Latest NX Update
Siemens Digital Industries Software unveils the latest updates to NX™ and NX™ X, its product engineering software, driving CAD innovation through AI c..
2025.07.14 by 명세환 기자
ST Transforms Notebook User Experience with Advanced User Detection Solution
STMicroelectronics has combined Time-of-Flight (ToF) based sensor technology with proprietary AI algorithms to simultaneously achieve security, power ..
2025.07.11 by 명세환 기자

