전체기사7,111건
Keysight Supports Qutel 5G RedCap NTN Module Verification
Keysight Technologies validated on the 25th that IoT wireless modules support the latest 5G RedCap (Reduced Capability) and Non-Terrestrial Network (N..
2023.07.25 by 김예지 기자
Future Electric Vehicle Thermal Management Technology ② - "Electric Vehicle Thermal Management: Heat Pumps, Eco-Friendly Technology, Multi-Way Valves, Modularization"
Following the previous article covering thermal management technology for motors and batteries, this article addresses thermal management technology f..
2023.07.24 by 성유창 기자
.jpg)
ST Begins Mass Production of PowerGaN Devices
ST is mass-producing enhancement-mode (e-Mode) PowerGaN HEMT (High-Electron-Mobility Transistor) devices that simplify the design of high-efficiency p..
2023.07.24 by 배종인 기자
Hyundai Motors and Kia Nano Technology Lead Future Innovation and Changes in Electrification and SDV
Hyundai Motor and Kia unveiled coating technologies based on nano materials to lead future innovation and transformation in electrification and SDV, a..
2023.07.24 by 성유창 기자
.jpg)
ST Launches Full Support for High-Performance Power Tools
Würth Elektronik and STMicroelectronics (hereinafter referred to as ST) have joined forces to support high-performance specialty tools.
2023.07.21 by 배종인 기자
Mouser now stocks NXP i.MX 8M Plus processors.
Mouser Electronics supplies NXP Semiconductors' i.MX 8M Plus application processor products.
2023.07.21 by 배종인 기자
13 National Advanced Strategic Industry and Small Business Specialized Complexes Designated at 620 Trillion Won
The creation of national advanced strategic industry specialized zones and specialized complexes for parts, materials, and equipment (SME parts and ma..
2023.07.21 by 명세환 기자
Lattice Drive Solutions Stack Accelerates Automotive Application Development
Lattice Semiconductor has unveiled a drive solution stack that supports infotainment connectivity and processing, flexible ADAS, and low-power zone br..
2023.07.20 by 성유창 기자
EMI/EMC(1)-EMI packaging, increasing demand in mobile and automotive
"Packaging is not a single major field. Semiconductor packaging contains everything—electronics, mechanics, materials, and chemistry all mixed togethe..
2023.07.20 by 명세환 기자
ROHM Launches Low-Power, Compact EcoGaN™ Power Stage ICs
Rohm has developed power stage IC 'BM3G0xxMUV-LB' (BM3G015MUV-LB, BM3G007MUV-LB) that integrates 650V GaN HEMT for primary power supply applications u..
2023.07.20 by 배종인 기자
Samsung Electronics Develops Industry's First GDDR7 DRAM
Samsung Electronics has developed GDDR7 DRAM operating at 32Gbps, the industry's fastest speed, taking the lead in the next-generation graphics DRAM m..
2023.07.19 by 배종인 기자
Onsemi to integrate SiC devices with BorgWarner VIPER
ON Semiconductor announced that it has expanded its strategic partnership with BorgWarner regarding silicon carbide (SiC) and concluded a long-term co..
2023.07.19 by 배종인 기자