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AMD Launches New Ryzen Embedded 5000 Series Processors
AMD announced on the 21st that it has launched a new high-performance AMD Ryzen™ Embedded 5000 series.
2023.04.21 by 명세환 기자
Vertiv Named Frost & Sullivan's '2022 Company of the Year'
Vertiv, a specialist company in critical digital infrastructure and continuity solutions, has been recognized by Frost & Sullivan for pioneering innov..
2023.04.20 by 배종인 기자
ST Launches 100W and 65W VIPerGaN Converters
STMicroelectronics (hereinafter ST) supports space reduction and efficiency improvement in consumer and industrial applications through the launch of ..
2023.04.20 by 배종인 기자
TI Launches Standalone AEF IC… “Provides High Density, 3MHz or Less EMI Solution”
As wide bandgap compound semiconductors continue to gain market share in automotive, aerospace, and industrial applications, while these devices offer..
2023.04.18 by 명세환 기자
[Technical Contribution] ADI Michael Hate – How to Add Authentication Security to Vehicle Endpoints Using a Single PIN
ADI's DS28E40 adopts the ECDSA public key security algorithm, making it easy to implement a security layer on the ECU host processor, and a single IC ..
2023.04.17 by 명세환 기자
Korea, Kazakhstan expand cooperation in plants and mineral resources
The Ministry of Industry announced that it discussed economic cooperation with Kazakhstan to secure orders for projects in energy and materials plants..
2023.04.14 by 성유창 기자
Korea Mechanical Engineering & Construction Co. develops filter-free air purification technology
A technology that reduces ultrafine dust without filters using electrostatics has been developed for the first time worldwide, making it possible to s..
2023.04.13 by 배종인 기자
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NVIDIA Launches GeForce RTX 4070
Nvidia (CEO Jensen Huang), a leader in AI computing technology, has launched the new GeForce RTX 4070, which supports Nvidia Reflex across multiple ti..
2023.04.13 by 배종인 기자
Intel's Angstrom and Arm Core SoCs Join Forces
Intel Foundry Services (hereinafter IFS) and Arm announced a multi-generation collaboration plan enabling chip designers to create low-power computing..
2023.04.13 by 배종인 기자
ROHM Develops Low ON Resistance, High Efficiency Operation Nch MOSFET
ROHM has developed 13 products (40V/60V/80V/100V/150V) in the Nch MOSFET 'RS6xxxxBx/RH6xxxxBx series' optimized for driving applications operating as ..
2023.04.13 by 배종인 기자
Vicor Unveils High-Performance Modular Power Conversion Solution for xEVs at WCX 2023
Vicor will present innovative xEV power conversion methods utilizing its scalable, high-density modular power system technology through four papers ci..
2023.04.12 by 배종인 기자
Nepes Secures High-Density, Ultra-Thin 3D Packaging Technology
Advanced semiconductor back-end foundry specialist Nepes (CEO Lee Byung-gu) has secured high-density ultra-thin film 3D packaging technology applicabl..
2023.04.12 by 배종인 기자