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TI Launches Standalone AEF IC… “Provides High Density, 3MHz or Less EMI Solution”
As wide bandgap compound semiconductors continue to gain market share in automotive, aerospace, and industrial applications, while these devices offer..
2023.04.18 by 명세환 기자
[Technical Contribution] ADI Michael Hate – How to Add Authentication Security to Vehicle Endpoints Using a Single PIN
ADI's DS28E40 adopts the ECDSA public key security algorithm, making it easy to implement a security layer on the ECU host processor, and a single IC ..
2023.04.17 by 명세환 기자
Korea, Kazakhstan expand cooperation in plants and mineral resources
The Ministry of Industry announced that it discussed economic cooperation with Kazakhstan to secure orders for projects in energy and materials plants..
2023.04.14 by 성유창 기자
Korea Mechanical Engineering & Construction Co. develops filter-free air purification technology
A technology that reduces ultrafine dust without filters using electrostatics has been developed for the first time worldwide, making it possible to s..
2023.04.13 by 배종인 기자
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NVIDIA Launches GeForce RTX 4070
Nvidia (CEO Jensen Huang), a leader in AI computing technology, has launched the new GeForce RTX 4070, which supports Nvidia Reflex across multiple ti..
2023.04.13 by 배종인 기자
Intel's Angstrom and Arm Core SoCs Join Forces
Intel Foundry Services (hereinafter IFS) and Arm announced a multi-generation collaboration plan enabling chip designers to create low-power computing..
2023.04.13 by 배종인 기자
ROHM Develops Low ON Resistance, High Efficiency Operation Nch MOSFET
ROHM has developed 13 products (40V/60V/80V/100V/150V) in the Nch MOSFET 'RS6xxxxBx/RH6xxxxBx series' optimized for driving applications operating as ..
2023.04.13 by 배종인 기자
Vicor Unveils High-Performance Modular Power Conversion Solution for xEVs at WCX 2023
Vicor will present innovative xEV power conversion methods utilizing its scalable, high-density modular power system technology through four papers ci..
2023.04.12 by 배종인 기자
Nepes Secures High-Density, Ultra-Thin 3D Packaging Technology
Advanced semiconductor back-end foundry specialist Nepes (CEO Lee Byung-gu) has secured high-density ultra-thin film 3D packaging technology applicabl..
2023.04.12 by 배종인 기자
Nordic Launches 4th Generation Bluetooth LE SoC 'nRF54H20'
Nordic Semiconductor, which has established new milestones in Bluetooth LE technology (Korea General Manager Choi Soo-chul), is realizing innovative I..
2023.04.12 by 배종인 기자
Tesla's 48V E/E Architecture Introduces Strengthening Components Ecosystem
Tesla demonstrated that its supply chain ecosystem leverage has been sufficiently strengthened by announcing its transition to a 48V-based E/E archite..
2023.04.10 by 성유창 기자
Microchip's LoRa solution makes it easy to build long-range wireless communication environments.
At the e4ds news webinar held last March, Ki-beom Kim, Senior Manager of Microchip's Wireless Communication Solutions, presented on "LoRa Solutions: L..
2023.04.10 by 김예지 기자