전체기사7,168건
Infineon Unveils IGBT Modules Supporting Up to 900A Rated Current
Infineon announced that its EconoDUAL 3 portfolio adopting TRENCHSTOP IGBT7 chips offers current ratings in 300A to 900A configurations. These product..
2021.09.15 by 이수민 기자
Silicon Labs Announces Secure Sub-GHz SoC with 1-Mile Range
Silicon Labs announced on the 15th a new sub-GHz wireless SoC operating below 1GHz that supports long-range RF performance and energy efficiency while..
2021.09.15 by 이수민 기자
ST Launches 200W Digital Power Solution for Eco-friendly LED TVs
STMicroelectronics announced on the 15th that it has launched the STEVAL-NRG011TV board, which enables designers to rapidly implement 200W digital pow..
2021.09.15 by 이수민 기자
[China Briefing] China's YMTC Begins Shipping 64-Layer 3D NAND
Summary of notable China ICT news - September 15, 2021 [China Briefing]: ◇China's YMTC ships 64-layer 3D NAND, soon to mass-produce 128-layer QLC ◇Chi..
2021.09.15 by 이춘영 외신
SK Materials Invests 850 Billion Won in Silicon Anode Materials
SK Materials (CEO Lee Yong-wook) will invest 850 billion won in silicon anode material business, which is expected to be a next-generation battery ano..
2021.09.15 by 배종인 기자
Understanding PSU dynamic control behavior using Bode plots
Power supplies typically maintain a fixed output voltage through a control loop. This control loop can be either stable or unstable. Additionally, the..
2021.09.14 by 이수민 기자
Applied Materials Unveils Two Types of SiC Wafer Equipment
SiC material is sensitive to native defects compared to Si, which can degrade electrical performance, power efficiency, reliability, and yield. Theref..
2021.09.14 by 이수민 기자
[Planning] Power & Sensors ② - Reliable Industrial Solutions for the Most Harsh Environments
Infineon is actively engaged in developing next-generation silicon and wide-bandgap power portfolios as well as cutting-edge sensor products, based on..
2021.09.14 by 명세환 기자
As demand for high-performance semiconductors grows, the importance of post-process packaging grows.
Packaging, a representative post-process in semiconductor manufacturing, is the process of encapsulating devices fabricated in the front-end process t..
2021.09.13 by 이수민 기자
Microchip Unveils 1.6T Ethernet PHY Supporting Up to 800 GbE
To address growing data center traffic, high bandwidth, port density, and up to 800 gigabit ethernet connectivity are required. In response, Microchip..
2021.09.09 by 이수민 기자
TI Announces 70W BLDC Motor Driver: No Drive Software Required
The transition from AC induction motors to BLDC motors is happening rapidly. Now, the development of next-generation devices hinges on faster motor re..
2021.09.09 by 이수민 기자
KERI develops high-efficiency lithium storage technology for lithium metal batteries
Dr. Kim Byung-gon (Senior Researcher) of the Next-Generation Battery Research Center at the Korea Electrotechnology Research Institute (KERI, Presiden..
2021.09.09 by 배종인 기자