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[Planning] Rapidly Growing Power Semiconductor Market, Urgent Need to Strengthen Competitiveness
The power semiconductor market is projected to grow to approximately $53 billion in 2023, and with increasing demand for power semiconductors in elect..
2021.07.20 by 배종인 기자
[China Briefing] Huawei to Mass Produce OLED Driver Chips Next Year
e4ds News - China ICT Briefing - July 20, 2021 [China Briefing]: ◇Huawei "OLED Driver Chip Trial Production" - Mass Production in First Half of Next Y..
2021.07.20 by 이수민 기자
Next-generation semiconductor process "5nm FinFET is falling, 3nm GAA is rising"
The FinFET technology that led semiconductor miniaturization process technology is declining, while Gate-All-Around (GAA) technology is emerging as th..
2021.07.20 by 이수민 기자
Mouser to Supply Maxim's Automotive DP Backlight Drivers
Mouser Electronics announced that it supplies the Maxim Integrated MAX25530 automotive 4-channel backlight driver product. The MAX25530 integrates an ..
2021.07.20 by 명세환 기자
[China Briefing] China's Three Major Cloud Companies Develop In-House Chips
e4ds News Summary of ICT News from Greater China - July 19, 2021 [China Briefing]: ◇"Developing Cloud-Dedicated Chips" Baidu-Alibaba-Tencent Actively ..
2021.07.19 by 이수민 기자
Dutch Government Halts ASML EUV Equipment Exports to China: "Why?"
ASML, the world's second-largest semiconductor equipment manufacturer, is facing restrictions on EUV equipment exports to China due to a hold on autho..
2021.07.19 by 이수민 기자
"Will a mobile AlphaGo come out?" KAIST develops high-efficiency AI semiconductor
Professor Yu Hoe-jun's team at KAIST announced that they have developed semiconductor technology capable of processing deep reinforcement learning (DR..
2021.07.16 by 이수민 기자
Rohm Develops 75W High-Power Laser Diode for LiDAR
Rohm has developed the RLD90QZW3, a high-power semiconductor laser diode for industrial and consumer devices equipped with lidar for distance measurem..
2021.07.16 by 명세환 기자
Congatec Launches Durable 11th Gen Intel Core-Based COM
Congatec Korea has launched 'conga-TC570r COM Express,' a new computer-on-module (COM) product based on 11th generation Intel Core processors with enh..
2021.07.16 by 강정규 기자
Quickso-ST Accelerates IoT Device Development with ML-Enabled Motion Sensors
The ST MLC sensor reduces overall system power consumption by executing sensing-related algorithms on the detected data set independently, rather than..
2021.07.16 by 강정규 기자
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TI Unveils High-Performance MCU to Advance Edge Applications
As industrial automation, next-generation automotive, intelligent analytics, and connectivity requirements intensify, demand for fast and accurate MCU..
2021.07.15 by 이수민 기자
Xilinx Introduces 'Versal HBM ACAP' Integrated with HBM2E DRAM
Real-time, high-performance applications experience bottlenecks due to memory bandwidth and can operate at the boundary of power and thermal limits. I..
2021.07.15 by 이수민 기자