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Schneider Unveils Integrated Power-Process Control System Management Solution
Schneider Electric has unveiled EcoStruxure Power and Process (ESPP), developed in collaboration with AVEVA. This platform integrates engineering desi..
2020.11.03 by 김동우 기자
96% efficient bidirectional power supply for drivetrains
Infineon's CoolSiC MOSFET has been adopted in EA Elektro-Automatik's PSB 10000 bidirectional power supply for electric drivetrain testing. Germany-bas..
2020.11.03 by 명세환 기자
The race for next-generation DRAM, DDR5, has begun: "2021 will be the start of a fierce battle in 2022."
JEDEC officially announced the standard specifications for DDR5, the next-generation DRAM, in July. Samsung Electronics and SK Hynix, the two global m..
2020.11.02 by 이수민 기자
WD and Dropbox to Unveil Low-Cost 'SMR HDD'
Dropbox utilizes Western Digital's SMR HDD at the exabyte scale. Through this, it provides service to more than 600 million online customers. The Ultr..
2020.11.02 by 김동우 기자
Samsung Electronics Launches Bespoke Air Conditioner to Elevate 'Class' in Commercial Spaces
Samsung Electronics will introduce its BESPOKE commercial stand air conditioner, combining powerful cooling and heating performance with sensible desi..
2020.11.02 by 김동우 기자
Nordic SoCs Adopted for BLE Modules for "Temperature-Sensitive" IoT Devices
Nordic Semiconductor announced that its nRF52833 and nRF52810 low-energy Bluetooth modules have been adopted for the core processing performance and w..
2020.11.02 by 이수민 기자
"SEDEX 2020," the largest-ever next-generation semiconductor competition
The 22nd Semiconductor Exhibition (SEDEX 2020) concluded on the 30th, completing a four-day event. This year, led by Samsung Electronics and SK Hynix,..
2020.11.02 by 이수민 기자
Toshiba begins shipping 32 LDOs suitable for mobile devices.
Toshiba announced the launch and shipment of 32 new LDO regulators in the TCR3RM series on the 30th, which stabilize DC power line outputs for mobile ..
2020.10.30 by 이수민 기자
'3D Image Sensor' Capable of Implementing AR 10m Ahead to Be Released
Infineon Technologies and pmd technologies' 3D depth sensor based on ToF (Time of Flight) technology delivers innovative consumer convenience with sup..
2020.10.30 by 김동우 기자
STMicroelectronics Launches All-in-One Multi-Zone Direct ToF Module
This device comprises a 940nm VCSEL light source, an SoC sensor integrating a VCSEL driver, a SPAD receive array, a low-power 32-bit MCU core, and an ..
2020.10.30 by 김동우 기자
Bycor Supports Design of "Modular PDN" for 48V Electric Vehicle Battery Packs
BTCC allows drivers to tactically use electric motors to enhance vehicle performance and acceleration. In response, Delta Motorsports has designed a n..
2020.10.30 by 명세환 기자
XP Power Launches Power Supply Producing Up to 50kW
The high-speed response device is capable of voltage regulation of 0.005% or better during line regulation and 0.01% or better during load regulation,..
2020.10.30 by 강정규 기자