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Infineon and Qualcomm Provide High-Quality Standard Solutions for 3D Authentication
Infineon has collaborated with Qualcomm to develop a reference design for 3D authentication based on the Qualcomm Snapdragon 865 mobile platform. This..
2020.03.11 by 최인영 기자
ON Semiconductor Launches 900V and 1200V SiC MOSFETs for High-Performance Applications
ON Semiconductor has expanded its WBG device portfolio by launching a SiC MOSFET product family that meets the requirements of high-growth application..
2020.03.11 by 최인영 기자
Technology developed to reduce electric vehicle battery size by half
Samsung Electronics Advanced Institute of Technology has developed groundbreaking technology to resolve the dendrite problem in all-solid-state batter..
2020.03.11 by 이수민 기자
Xilinx Unveils New ACAP to Enhance Adaptive Cloud
Xilinx has announced 'Versal Premium,' the third series in the Versal ACAP product family. Versal Premium integrates interconnected power-optimized co..
2020.03.11 by 이수민 기자
CyberLink Equips Industrial Computers with Face Recognition Engine
CyberLink's FaceMeAI face recognition engine is integrated into IEI's FLEX-BX200 AI modular box PC. This supports AI acceleration of the Mustang-V100-..
2020.03.11 by 이수민 기자
ON Semi Unveils Connected Lighting Platform with Ultra-Low Power PoE Capabilities
ON Semiconductor has unveiled the RSL10 SIP connected lighting platform, based on AC/DC and DC/DC power conversion designs including PoE and ultra-low..
2020.03.10 by 최인영 기자
TI Launches Stacked DC/DC Buck Converter to Maximize FPGA Power Density
TI has launched the new 40A SWIFT DC/DC buck converter TPS546D24A PMBus, the industry's first buck converter capable of stacking up to four ICs. This ..
2020.03.10 by 최인영 기자
5G millimeter wave networks: essential infrastructure for the 2020s.
The ultra-high-speed characteristics of 5G can be achieved through the use of millimeter-wave bands. Millimeter waves have short wavelengths, enabling..
2020.03.09 by 이수민 기자
Mentor Receives Certification for UMC's 22nm Ultra-Low Power Process Technology Compliance
Mentor Siemens' Calibre platform, Analog FastSpice platform, and Nitro SoC digital design platform have received certification for UMC's 22uLP process..
2020.03.09 by 최인영 기자
Nordic accelerates smart home product development with Amazon ACS
Nordic announced that it will support Amazon's ACS to accelerate the development of wireless products, including smart home applications. ACS provides..
2020.03.06 by 이수민 기자
Infineon Launches CoolSiC MOSFET 650V Family with Enhanced Energy Efficiency and Power Density
Infineon is adding 650V products to its silicon carbide portfolio in response to growing demand for improved energy efficiency and power density. The ..
2020.03.05 by 최인영 기자
5G to Account for Over 10% of Global Mobile Connections in 2023
Cisco Systems released its annual Internet report, forecasting that 5G will account for more than 10% of global mobile connections by 2023. The report..
2020.03.05 by 이수민 기자