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Dell Technologies and Corestone Open Proof-of-Concept Center in Seoul
The Dell Technologies-Corestone PoC Center supports customers planning to purchase solutions in conducting proof-of-concept and testing required for t..
2020.01.15 by 이수민 기자
Infineon Launches 650V Half-Bridge Gate Driver
Infineon Technologies has launched a 650V half-bridge SOI driver with an integrated bootstrap diode. The device features enhanced negative transient v..
2020.01.14 by 최인영 기자
Semicon Korea 2020 Keynote Speakers Confirmed, AI is Key Again
Four keynote speakers have been confirmed for Semicon Korea 2020. The keynote session, featuring key executives from SK Hynix, Intel, imec, and Graphc..
2020.01.14 by 이수민 기자
ST, Cisco Demonstrate Vehicle Security Connectivity
ST Microelectronics jointly with Cisco showcased a secure telematics solution demo targeting the automotive market through CES 2020. The solution enha..
2020.01.13 by 최인영 기자
Niu, Implementation of Urban Autonomous Mobility Network
Niu Technologies has implemented an urban autonomous mobility network equipped with 5G connectivity, autonomous driving, and self-balancing capabiliti..
2020.01.10 by 최인영 기자
ST-Cree Doubles SiC Wafer Supply Agreement
The adoption of silicon carbide (SiC)-based power solutions is rapidly increasing across automotive and industrial markets. ST and Cree announced on t..
2020.01.10 by 이수민 기자
ST Supports LoRa IoT Connectivity with STM32WLE5 SoC
ST has announced a LoRa SoC that connects smart devices to IoT using long-range wireless connectivity. Product developers can use the STM32WLE5 SoC to..
2020.01.09 by 이수민 기자
Launch of a bidirectional DC PLC IC that reduces the size of wireless earphones.
Maxim has introduced the MAX20340, a bidirectional DC power line communication (PLC) IC. Low-power portable device and wearable designers can use the ..
2020.01.08 by 이수민 기자
Infineon Develops World's Smallest 3D Image Sensor
Infineon developed the world's smallest ultra-compact 3D image sensor chip IRS2887 in collaboration with pmd technologies, a 3D ToF system specialist,..
2020.01.08 by 최인영 기자
The next-generation Bluetooth 'LE Audio' specification, designed for the hearing impaired, will be released in the first half of this year.
Bluetooth SIG announced the launch of LE Audio, the next-generation Bluetooth audio technology. LE Audio not only enhances Bluetooth audio performance..
2020.01.08 by 이수민 기자
XP Power Launches High-Voltage DC/DC Power Modules
XP Power has launched a 30Watt DC/DC power module that generates up to 6kVDC from a single 24VDC input. The HRL30 series provides controllable high-vo..
2020.01.07 by 최인영 기자
[e-TECH] Stop the location service that can't even change lanes... High-precision location recognition in cm units becomes a reality
Implementing fully autonomous driving requires mapping, localization, sensing, and planning. Current GPS technology can only provide approximate locat..
2020.01.07 by 최인영 기자