전체기사7,168건
ST Showcases Smart Factory Total Solution at 2019 KES
ST participates in KES 2019 to demonstrate Smart Industry Demo solutions. Based on diverse features including AI (Artificial Intelligence)-based image..
2019.10.11 by 명세환 기자
Intel's 10th-generation Core processors will coexist on both 10nm and 14nm processes.
Intel has introduced its 10th generation Core processors for laptops, new desktop Core X processors, and Xeon X-2000 processor family for workstations..
2019.10.10 by 이수민 기자
NXP Announces Deep Learning Toolkit for Next-Generation Automotive Development
NXP Semiconductors announced the launch of eIQ Auto, a deep learning toolkit for automotive applications, expanding its eIQ machine learning product p..
2019.10.10 by 명세환 기자
ST Launches Distortion-Free High-Voltage LED Driver for Future Energy-Saving Lighting
ST has launched the HVLED007 AC/DC LED driver featuring a new distortion-cancelling Input-Current Shaping (ICS) circuit. This is expected to enable th..
2019.10.10 by 명세환 기자
Microchip Launches Bluetooth 5.0 Certified Dual-Mode IC and Module
Microchip Technology has launched the IS2083, a Bluetooth 5.0 certified dual-mode audio IC, and the BM83 module, which has received certification with..
2019.10.08 by 이수민 기자
Visualizing Smart Factories with Real-Virtual Synchronization CPS
Smart manufacturing is manufacturing utilizing ICT, and the production system that implements this is a smart factory. A smart factory combines variou..
2019.10.07 by 이수민 기자
Three 5G NR Challenges That Can Be Solved Right Now
Korea's 5G is preparing for a step-by-step upgrade to meet market demands. This represents a leap from the 3.5GHz frequency band, known as 4.5G since ..
2019.10.07 by 명세환 기자
eGaN FET for LiDAR - Maximizing Laser Driver Performance Part 2
LiDAR is a form of radar that generates electromagnetic waves in a broadband spectrum. Over the past several years, a specific type of LiDAR known as ..
2019.10.07 by 최인영 기자
Samsung Electronics Creates 24GB HBM with 12-Layer 3D-TSV Technology
Samsung Electronics has developed 12-layer 3D through-silicon via (3D-TSV) technology. 12-layer 3D-TSV is a packaging technology that instead of conne..
2019.10.07 by 이수민 기자
Schneider Presents Future Strategies for Energy Efficiency and Sustainability at CCIB 2019
Schneider Electric participated in CCIB 2019 and presented its future strategy for digital energy management to enhance energy efficiency. During the ..
2019.10.04 by 명세환 기자
Silicon Labs Supports Simplifying IoT Product Design with New Mesh Networking Module
Silicon Labs has launched new wireless Gecko modules to help IoT developers reduce product development costs and design complexity. The MGM210x and BG..
2019.10.04 by 이수민 기자
Maxim Launches Buck-Boost Converter with 98% Peak Efficiency and 6μA Quiescent Current
Maxim Integrated Korea announced the MAX77827, a buck-boost converter that achieves 96% peak efficiency and 6μA standby current. The newly announced b..
2019.10.04 by 명세환 기자