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ROHM Launches SiC MOSFET in TO-247-4L Package
Rohm has launched six types of 650/1200V SiC MOSFETs with trench gate structure (SCT3xxx xR series) suitable for high-efficiency server power supplies..
2019.09.19 by 이수민 기자
ADI Unveils Dual-Drive Capability Output Driver for IIoT Applications, Boosting Power Efficiency and Reducing Electromagnetic Emissions
Analog Devices has unveiled the ADuM4122, an isolated dual-channel gate driver based on its iCoupler technology. The ADuM4122 enables designers to lev..
2019.09.19 by 최인영 기자
ON Semiconductor Unveils Square 300,000-Pixel Image Sensor
onsemi has unveiled the ARX3A0 digital image sensor, which delivers a resolution of 300,000 pixels in a 1:1 aspect ratio. The ARX3A0 operates like a g..
2019.09.19 by 이수민 기자
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AI wind blowing in the financial world, what can FPGA do?
As fintech becomes mainstream, the financial industry has faced the challenge of efficiently processing explosively increasing data. The financial sec..
2019.09.17 by 이수민 기자
Eunpyeong St. Mary's Hospital Establishes Uninterrupted Power Supply System with SE 'EcoStruxure Power'
Hospitals that handle human lives require the construction of safe and efficient energy supply systems. In response, Ewha Womans University Eunpyeong ..
2019.09.10 by 이수민 기자
eGaN FETs for LiDAR - Getting the Most Out of Laser Drivers Theory
Lidar is a form of radar that generates electromagnetic waves in a broad spectrum. Over the past several years, Time-of-Flight (TOF) distance measurem..
2019.09.09 by 명세환 기자
Applied Materials Launches Mass Production Solutions for Three Next-Generation Memory Types: M-RAM, Re-RAM, and PC-RAM
In the AI and big data era, the memory sector requires innovations at the angstrom unit level, which is more precise than nanometers, and must address..
2019.09.09 by 이수민 기자
The Impact of AI/ML/DL on Semiconductor Design and EDA Tools
Mentor, a Siemens business, held Mentor Forum 2019, its annual EDA event. Joseph Sawicki, Senior Vice President of Mentor's IC EDA Division, who visit..
2019.09.09 by 이수민 기자
Four ITU-T security standards proposed by Korea have been pre-adopted.
Four recommendations for intelligent vehicle security, quantum cryptographic communications, and smart grid, developed under Korea's leadership, have ..
2019.09.09 by 이수민 기자
Huawei Unveils 5G Smartphone SoC Smaller Than Samsung and Qualcomm
Huawei unveiled new Kirin SoCs at IFA 2019, introducing the Kirin 990 and Kirin 990 5G. In particular, the Kirin 990 5G integrates a 5G modem to reduc..
2019.09.08 by 이수민 기자
ON Semiconductor Introduces Two PoE Interface Controllers Compliant with IEEE 802.3bt
The IEEE 802.3bt standard for PoE has the potential to transform the IoT market by enabling sophisticated devices connected to larger networks. On Sem..
2019.09.07 by 이수민 기자
22 Locations Selected for Big Data Platform and Center Construction Project
The Ministry of Science and ICT announced the selection results for big data platform and center construction projects. In June, the ministry selected..
2019.09.06 by 이수민 기자