Power / Power Electronics

Applied, “Ru utilization reduces power consumption by 25% and reduces gap resistance, innovating semiconductor processes below 2nm”

Applied Materials has disclosed that it is already supplying semiconductor manufacturers with technology that utilizes ruthenium (Ru), which has been ..

2024.10.14 by 배종인 기자

DeepX to Unveil ‘Butter Benchmark’ at 2024 Semiconductor Expo

DeepX will disclose its technological achievements in AI semiconductors that have gained traction in the global market and its commercialization resul..

2024.10.14 by 명세환 기자

Intel Launches First Intel Core Ultra Desktop Processors for AI PCs

Intel announced on the 11th the launch of its first desktop AI PC processor family, the Intel Core Ultra 200S series, which extends AI PC functionalit..

2024.10.11 by 명세환 기자

Generation AI 323x Compression Low-Power AI Path Opened

Professor Yoo Jae-jun's team at the Graduate School of Artificial Intelligence at UNIST (President Park Jong-rae) presented three papers at ECCV (Euro..

2024.10.09 by 배종인 기자

ST, improving smart edge performance and efficiency

STMicroelectronics (hereinafter referred to as ST), a global semiconductor company supporting diverse electronic applications and customers, has launc..

2024.10.09 by 배종인 기자

Mouser, MyIR Tech MYC-LR3568 SoM in stock

Mouser Electronics™, an industry-leading new product introduction (NPI) distributor handling the broadest range of semiconductors and electronic compo..

2024.10.09 by 배종인 기자

On-device AI use cases are expanding...Computer vision utilization is increasing

On-device AI technology, which performs artificial intelligence inference at the device level without network dependency and offers advantages in resp..

2024.10.08 by 권신혁 기자

AMD Launches EPYC™ Embedded 8004 Series

AMD announced the "EPYC™ Embedded 8004 series," a new embedded product family that delivers outstanding performance in demanding embedded environments..

2024.10.07 by 배종인 기자

Kobo, Next-Generation Matter for Seamless Smart Home Connection

Qorvo®, a global leader in wireless communication and power solutions, has launched a new System-on-Chip (SoC) solution for smart home devices and is ..

2024.10.07 by 배종인 기자

u-blox solves remote connectivity issues

u-blox has launched the SARA-S528NM10, its first 3GPP-compatible integrated IoT module combining terrestrial network (TN) and non-terrestrial network ..

2024.10.07 by 배종인 기자

[Contribution] Professor Kim Pil-su of Daerim University - “Announcement of cause of Mercedes-Benz electric car fire raises awareness of electric car owners’ safety”

I recently heard from Professor Kim Pil-soo at Daelim University about the fire forensic analysis results for Mercedes-Benz's electrification that was..

2024.09.30 by 명세환 기자

[STM32 Summit] ST Hyundai Vice President and Vice President Lee Jun-ho, “ST’s Next-Generation Microprocessor Implements Edge AI Solutions”

[Editor's Note] The use of ST MCUs is becoming commonplace across industries and products. In particular, STM32 products now exceed 3,000 variants, wi..

2024.09.27 by 권신혁 기자

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