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HPSP, Strengthening R&D of High Pressure Annealing and Oxidation Processes
HPSP, a Korean front-end semiconductor equipment manufacturer, and imec have announced that they signed a Joint Development Project agreement on the 1..
2024.01.15 by 권신혁 기자
Mouser Adds Over 8,000 New Products in Q4 2023
Mouser supplied over 66,000 latest components available for same-day shipment in the fourth quarter of 2023, including more than 8,000 components that..
2024.01.12 by 배종인 기자
Cadence Partners with Samsung Electronics for 5G Chip Verification Solutions
Cadence Design Systems, Inc. announced on the 12th that Samsung Foundry successfully completed tape-out of a 5G networking SoC based on Samsung's 5LPE..
2024.01.12 by 김예지 기자
Personal AI computing is in full swing, and chipmakers are waging a war over AI semiconductors.
At CES 2024, a large number of chip solutions that substantialize personal AI computing are emerging. This ranges from GPUs that enhance generative AI..
2024.01.11 by 권신혁 기자
Ministry of Trade, Industry and Energy to Fully Promote Supply Chain Stabilization Project in 2024… R&D Support to 4x, Support for Stockpiling Core Minerals to 6x↑
The Ministry of Trade, Industry and Energy (hereinafter referred to as the Ministry) will significantly expand research and development (R&D) for supp..
2024.01.11 by 성유창 기자
Onsemi and Lee Auto Extend Strategic Agreement… Accelerate Development of Next-Generation Smart Electric Vehicles
Li Auto has adopted onsemi's high-efficiency EliteSiC 1200V bare die for its next-generation 800V battery electric vehicle (BEV), and will expand inte..
2024.01.10 by 성유창 기자
Intel Announces 'AI Everywhere' Strategy for SDV SoCs
Intel announced on the 10th (local time) at CES that it plans to lead an AI Everywhere strategy for the automotive market, including the acquisition o..
2024.01.10 by 권신혁 기자
ST offers free software pack enabling the use of additional features on high-performance MPUs
ST Microelectronics (hereinafter ST) is providing a new software package free of charge that enables users to migrate existing code designed for simpl..
2024.01.10 by 성유창 기자
CES 2024 On-Device AI Fever, DeepX AI Semiconductor 4 Types Unveiled
On-device AI competition is unfolding at CES 2024. Global companies, chip makers, and startups are showcasing edge AI solutions simultaneously, markin..
2024.01.10 by 명세환 기자
ROHM Develops Thermal Print Head Capable of High-Speed, High-Definition Printing with a Single Lithium-Ion Battery
ROHM has developed a new-structure thermal print head 'KR2002-Q06N5AA' that operates on a single lithium-ion battery cell (3.6V) and realizes high-per..
2024.01.09 by 배종인 기자
NVIDIA Launches 'GeForce RTX 40 Super' GPU... "Accelerate Creation of AI on PC"
NVIDIA announced a new 'GeForce RTX 40 SUPER GPU' series with generative AI performance at CES 2024, held on the 9th in Las Vegas. Additionally, it un..
2024.01.09 by 김예지 기자
'Act on Carbon Dioxide Capture, Transport, Storage and Utilization' Passes in National Assembly
The 'Bill on the Enactment of the Act on Capture, Transport, Storage and Utilization of Carbon Dioxide' passed the plenary session of the National Ass..
2024.01.09 by 배종인 기자