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Western Digital Unveils New Solutions, Including UHS-I MicroSD Cards, at MWC 2018
Western Digital unveiled its latest product, the "400GB SanDisk Extreme UHS-I microSDXC card," the industry's fastest UHS-I memory card, at Mobile Wor..
2018.02.28 by 김지혜 기자
ADI Launches 42V Quad-Output Monolithic Switching Regulator
Analog Devices announced the launch of the Power by Linear™ LT8603, a new quad-output monolithic switching regulator capable of 42V input. The new pro..
2018.02.27 by 김학준 기자
Limelight Networks Announces Multi-DRM on the Fly
Limelight Networks has announced "Multi-DRM On the Fly," an integrated Digital Rights Management (DRM) solution. By adding this solution to video deli..
2018.02.27 by 김학준 기자
Long-lasting laptop 'LG Gram' becomes a million-seller
LG Electronics has achieved "Million Seller" status as the "LG gram" has surpassed 1 million cumulative units sold in Korea. The LG gram features slot..
2018.02.22 by 김학준 기자
NI and Samsung Electronics Collaborate to Develop 5G NR Test UE for 28GHz
National Instruments announced that it is collaborating with Samsung Electronics to develop a 5G test UE for 5G NR (New Radio). As a result of this c..
2018.02.22 by 김지혜 기자
Molex Korea Launches Ultra-Small-Pitch Wire-to-Board Connection System Ideal for Small Electronic Devices
Korea Molex has launched the Pico-EZmate Slim 1.20mm pitch wire-to-board connector with a compact structure that improves both reliability and assembl..
2018.02.21 by 김지혜 기자
Samsung Electronics Leads the Ultra-High-Capacity Storage Market with Mass Production of 30.72TB SAS SSDs
Samsung Electronics has launched the '30.72TB SAS (Serial Attached SCSI) SSD' (PM1643), which delivers up to twice the capacity and performance compar..
2018.02.20 by 김지혜 기자
ASUS Officially Supports AMD's 'Raven Ridge' Processor
ASUS announced that it officially supports AMD's new Ryzen Raven Ridge processors, 'RYZEN™ 5 2400G' and 'RYZEN™ 3 2200G'. The 'RYZEN™ 5 2400G' and 'R..
2018.02.13 by 김학준 기자
Miffy Alliance Releases Miffy Unipro Version 1.8
MIPI Alliance has launched MIPI UniPro v1.8, which is used to interconnect mobile chipsets and peripheral components. MIPI UniPro v1.8 features faste..
2018.02.12 by 김학준 기자
Mouser to Supply Amphenol's Amphe-PD Series of Connectors
Mouser Electronics supplies the Amphe-PD series connectors from Amphenol Industrial. Designed for connecting wire-to-wire, wire-to-board, and busbar t..
2018.02.12 by 김학준 기자
Lenovo Korea Launches Laptops Equipped with AMD Ryzen Mobile Processors
Lenovo Korea announced the launch of the GreatBook (IdeaPad 720S-13ARR), the thinnest and lightest ultraslim notebook equipped with AMD Ryzen Mobile p..
2018.02.12 by 김지혜 기자
Aveni succeeds in fabricating TSVs using Rhea Copper seeds.
Aveni S.A., a leader in wet deposition technology and compound solutions for 2D interconnects and 3D silicon through silicon via (TSV) packaging, anno..
2018.02.08 by 명세환 기자

