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AMD and Rackspace Sign Agreement to Build Phase of 30MW AMD AI Infrastructure
AMD and Rackspace Technology entered into a contract on June 17th to build initial dedicated AI computing infrastructure with a capacity of 30MW. This..
2026.06.17 by 배종인 기자
Intel Foundry Enters Test Production of 18A-P Process
Intel Foundry announced entry into pilot production of the 18A-P process at the 2026 VLSI Symposium, achieving 9% performance improvement at the same ..
2026.06.17 by 배종인 기자
Etipos Listed as Key Global V2X Chipset Company… Attention Drawn to Software-Defined 5G-V2X Technological Capabilities
Ettipos, a vehicle-to-everything (V2X) communication semiconductor specialist, has been officially listed as a key company in the 'V2X Chipset Market'..
2026.06.17 by 배종인 기자
LG Innotek, “Challenging for 1 Trillion Won Operating Profit in Package Solutions”… 1 Trillion Won Investment in Vietnam by 2028
LG Innotek held a media tech day on the 16th at its headquarters in Mapo, Gangseo-gu, Seoul, introducing major products and core technologies in packa..
2026.06.17 by 배종인 기자
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Syma AI Launches Physical AI Development Platform 'Palette Neat'
Sima AI launched 'Palette Neat', an agentic development platform specialized in physical AI application development, on June 17th. It constructs the e..
2026.06.17 by 명세환 기자
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KIMM Develops AI-Based Intelligent System for 2D Semiconductor Plasma Process
The Korea Institute of Machinery and Materials (KIMM) announced on June 17 that a research team led by Senior Researcher Kim Hyung-woo has developed a..
2026.06.17 by 배종인 기자
Henkel, “Supporting Semiconductor Innovation with Advanced Electronic Materials Beyond Adhesives”
Global adhesive technology company Henkel is accelerating the expansion of its electronic materials business, including semiconductors, by positioning..
2026.06.16 by 배종인 기자
Applied Materials Unveils Deposition and Selective Etching Systems for 3D Semiconductor Processes
Applied Materials has unveiled new deposition and selective etch equipment to address 3D semiconductor structures with increased complexity due to AI ..
2026.06.16 by 배종인 기자
IAR, Infineon, Vector, and Qt Collaborate on Automotive Embedded Development Ecosystem
IAR Korea presented an integrated ecosystem cooperation plan with Infineon, Vector, and Qt Group to enhance the efficiency of automotive embedded soft..
2026.06.16 by 명세환 기자
Ansys Korea Shares AI Engineering Strategy at First Domestic Forum Since Integration
Ansys Korea held the 'Ansys Executive Forum 2026' and shared engineering innovation strategies for the AI era. This forum, the first to be held domest..
2026.06.15 by 명세환 기자
KIMS and KIST Discuss Cooperation on Advanced Materials and National Strategic Technologies
The Korea Institute of Materials Science and the Korea Institute of Science and Technology discussed cooperation strategies in advanced materials and ..
2026.06.15 by 배종인 기자
ST Launches 48V Automotive Predriver 'L98GD8E'
STMicroelectronics has launched the 'L98GD8E', a pre-driver IC for 48V automotive electrical systems. The product is an 8-channel MOSFET pre-driver th..
2026.06.15 by 배종인 기자