전체기사2,140건
Broadcom Joins Applied EPIC… Pursuing AI Packaging Collaboration
Applied Materials announced Broadcom as an EPIC platform partner and will collaborate on developing advanced packaging technologies for AI systems. Br..
2026.05.21 by 배종인 기자
ADI Strengthens AI Power Semiconductor with Acquisition of Empower
Analog Devices (ADI) is acquiring Empower Semiconductor for $1.5 billion to expand its power management portfolio for AI data centers. The acquisition..
2026.05.21 by 배종인 기자
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AMD Unveils 'EPYC 8005' Server CPU... Addressing Edge and Telecommunications Environments
AMD has unveiled its 'EPYC 8005' server CPU, targeting edge, telecommunications, and cloud storage environments.
2026.05.20 by 배종인 기자
ACM Ships First SiCN Deposition Equipment… Expanding Support for Advanced BEOL and Packaging Processes
ACM Research shipped its first PECVD SiCN system targeting advanced semiconductor back-end-of-line and packaging processes to a major semiconductor ma..
2026.05.20 by 명세환 기자
"The Solution to Complexity in the SDV Era: 'Formalization of Dependencies'"
At the Automotive & Future Mobility SW Conference 2026 held on the 13th at El Tower in Seoul, hosted by MDS Intelligence, Kim Jin-kwang, section chief..
2026.05.20 by 배종인 기자
Samsung Electronics Launches 6K Gaming Monitor 'Odyssey G8'
Samsung Electronics is launching four gaming monitor models for 2026, including the "Odyssey G8," which is the industry's first to support 6K resoluti..
2026.05.20 by 명세환 기자
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KIMS Develops TiAl Alloy Capable of Withstanding 950℃… Secures Lightweight Material Technology for Aircraft Engines
A research team at the Korea Institute of Materials Science has developed TiAl alloy technology that maintains stable performance in ultra-high-temper..
2026.05.20 by 배종인 기자
In the era of AI writing code, the solution for mobility software is 'static analysis'
On the 13th, at the 'Automotive & Future Mobility SW Conference 2026' hosted by MDS Intelligence at Grace Hall in El Tower, Yangjae, Seoul, Steve Howa..
2026.05.20 by 배종인 기자
“Smart Home Appliance Innovation Realized by AI, Matter, GaN, and IoT Technologies”
Infineon Technologies' recently published white paper "Engineering modern intelligent home appliances" points out that smart kitchens and intelligent ..
2026.05.20 by 배종인 기자
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SanDisk Unveils Large Number of New Consumer Storage Products
SanDisk held a press briefing on the 19th to introduce new product lineups for portable SSDs, announce a rebrand of its internal SSD offerings, and un..
2026.05.19 by 배종인 기자
Mouser supplies Microchip PIC32CM PL10 MCUs
Mouser Electronics has begun supplying Microchip Technologies' Arm Cortex-M0+ based PIC32CM PL10 MCU. This product family is characterized by providin..
2026.05.19 by 명세환 기자
ROHM Develops Power Solution for Automotive SoCs… Applying PMIC and DrMOS Combination
Rohm has developed a power solution combining PMIC 'BD968xx-C Series' for automotive SoCs and DrMOS 'BD96340MFF-C', responding to autonomous driving a..
2026.05.19 by 배종인 기자