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Samsung Electronics Unveils Next-Generation HBM4E at NVIDIA GTC… Highlighting Competitiveness as an AI Memory 'Total Solution'
Samsung Electronics participated in Nvidia GTC 2026, showcasing a memory integration strategy encompassing next-generation high-bandwidth memory (HBM)..
2026.03.17 by 배종인 기자
“The next stage for AI is the 'physical world'; low power consumption and high efficiency are key”
At the 'e4ds Physical AI Frontier 2026' conference, MATTEO MARAVITA, Head of the AI Competency Center for Sales & Marketing, APAC Region at STMicroele..
2026.03.17 by 배종인 기자
Microchip Expands TA101-Based Trust Platform… Supports Manufacturers' Response to Cybersecurity Regulations
As cybersecurity regulations become stricter, there is a growing trend of requiring security features during the product development phase for industr..
2026.03.16 by 배종인 기자
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L&F Unveils LFP Cathode Material Strategy at InterBattery 2026… Accelerating Establishment of Non-China Supply Chain
L&F unveiled next-generation cathode material technology and LFP (lithium iron phosphate) cathode material mass production plans at the domestic batte..
2026.03.16 by 배종인 기자
Nordic Unveils Cost-Effective Entry-Level Bluetooth LE SoC
Nordic Semiconductor, a specialist in low-power wireless connectivity technology, has unveiled the nRF54LS05A and nRF54LS05B, new Bluetooth LE System-..
2026.03.16 by 배종인 기자
KIMS Hosts Advanced Semiconductor Packaging Materials Innovation Forum… Discusses Technological Self-Reliance
The Korea Institute of Materials Science held a forum to discuss technological trends in advanced semiconductor packaging materials and industrial dev..
2026.03.16 by 명세환 기자
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Establishment of a national quantum research hub in Ulsan
Ulsan National Institute of Science and Technology (UNIST) held an opening ceremony for the 'UNIST Quantum Nano-Fab' on the 13th, officially launching..
2026.03.13 by 배종인 기자
ASRock Fully Supports 800 Series Motherboards Compatible with Intel Core Ultra 200S Plus
Global mainboard manufacturer ASRock's entire lineup of 800 series mainboards officially supports Intel's latest desktop processor 'Intel Core Ultra 2..
2026.03.13 by 배종인 기자
ROHM Unveils NFC Wireless Charging Chip Set for Ultra-Small Wearable Devices
Semiconductor specialist ROHM has introduced an NFC-based wireless charging IC chipset optimized for ultra-compact wearable devices such as smart ring..
2026.03.13 by 배종인 기자
AMD Leads Next-Generation AI Infrastructure, Launches Optical Scale-Up Standards Alliance
AMD, Broadcom, Meta, Microsoft, NVIDIA, and OpenAI have officially launched the 'OCI MSA (Optical Compute Interconnect Multi-Source Agreement)' consor..
2026.03.13 by 배종인 기자
Intel Achieves a Turning Point in Desktop Performance with 'Core Ultra 200S Plus'
Intel has set new performance benchmarks in the desktop market and announced a new product that will reshape the competitive landscape in gaming and c..
2026.03.12 by 배종인 기자
SanDisk Unveils New Industrial Memory Card Products
SanDisk announced new industrial memory cards, the SANDISK® IX QD352 microSD™ and IX LD352 SD, at 'Embedded World 2026' held in Nuremberg, Germany on ..
2026.03.12 by 배종인 기자