전체기사2,140건
Lam Research Launches Advanced Packaging Equipment for the AI Era
Global semiconductor equipment company Lam Research has launched VECTOR® TEOS 3D, an innovative deposition tool designed for the artificial intelligen..
2025.09.11 by 배종인 기자
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ARM Unveils Lumex CSS Platform, A Paradigm Shift in On-Device AI SoC Design
ARM announced its next-generation Lumex CSS (Compute Subsystem) platform, declaring a transition from a mere IP supplier to an SoC co-design partner. ..
2025.09.11 by 명세환 기자
Keysight Accelerates Innovation in the AI Era… 'Keysight World Tech Day 2025' Successfully Concludes
Keysight Technologies Korea (Keysight) held 'Keysight World Tech Day 2025,' showcasing the latest technologies in 6G, digital, and automotive fields t..
2025.09.11 by 배종인 기자
"6G: Rapid market entry through digital twin-based design, emulation, and verification is key to success."
Keysight Korea introduced next-generation technology innovation centered on 6G and Keysight's role in supporting it through a press briefing for Keysi..
2025.09.11 by 배종인 기자
"Redefining the power semiconductor, edge AI, and SDV industries: Not a combination of 'technological' functions, but a shift in mindset."
e4ds news held the '2025 e4ds Tech Day' event on the 9th at the International Conference Room of the Korea Science and Technology Center. Under the th..
2025.09.09 by 배종인 기자
Snowflake Solves Customer Technical Difficulties with Easy, Connected, and Trust Platform
Snowflake held a press briefing on the 8th at the Grand Intercontinental Seoul Parnas, emphasizing how its platform is revolutionizing enterprise data..
2025.09.08 by 배종인 기자
DeepX Proves High-Performance AI PC Compatibility and Real-Time Processing Capabilities
DeepX, an AI semiconductor specialist company (CEO Kim Nok-won), demonstrated high-performance AI PCs with its chipset integrated into HP Workstations..
2025.09.05 by 배종인 기자
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SK Hynix introduces memory industry's first high-NA EUV mass production equipment.
SK Hynix has begun full-scale leadership in next-generation semiconductor technology by introducing ASML's 'High NA EUV (High Numerical Aperture Extre..
2025.09.05 by 명세환 기자
KERI Breaks Through Lithium-ion Battery Limits, Laying Foundation for Mass Production of Silicon-Graphene Composite Anode Materials
The Korea Electrotechnology Research Institute (KERI) has independently developed a "silicon/graphene composite anode material" technology that is dra..
2025.09.01 by 명세환 기자
Microchip Strengthens Precision Timing Solutions for Aerospace and Defense
Microchip Technology has announced a new GNSS Disciplined Oscillator (GNSSDO) module portfolio for aerospace and defense applications. The new product..
2025.08.29 by 배종인 기자
Nordic Launches Bare Metal SDK for nRF54L Series, Significantly Boosting Development Flexibility
Nordic Semiconductor, a global leader in low-power wireless connectivity technology, has announced a new software option, 'nRF Connect SDK Bare Metal,..
2025.08.29 by 배종인 기자
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[2025 e4ds Tech Day] TI Vice President Seungmok Kim: "GaN Automotive Power Systems Open New Possibilities"
As automotive power systems rapidly evolve, GaN (Gallium Nitride) solutions are gaining attention as next-generation automotive power semiconductors, ..
2025.08.28 by 명세환 기자