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Sharing Security Management Strategies for Microchips and IoT Devices
Kwak Sang-shin, director at Microchip, will present on "IoT Device Security Lifecycle Management" at the "Microchip Tech Insight Korea" webinar on Apr..
2023.04.18 by 김예지 기자
TI's SimpleLink™ family of products enables efficient IoT connectivity.
Texas Instruments (hereinafter TI) has introduced the SimpleLink™ product family, designed to enable efficient IoT connectivity even in harsh environm..
2023.04.18 by 성유창 기자
SKT, Mobile Edge Computing (MEC) Broadcasting Transmission Platform Enters US Market
vSKT announced on the 18th that it has sold a broadcast transmission platform utilizing mobile edge computing (MEC) technology to Sinclair Broadcast G..
2023.04.18 by 김예지 기자
Microchip, Azure RTOS, Secure Element Use Authentication Information Shared
Microchip will be hosting a webinar that introduces methods for establishing secure authentication using Azure RTOS and security solutions.
2023.04.17 by 성유창 기자
The Korea Radio Promotion Association trains 7,000 new talents annually, demonstrating its strength in responding to technological trends.
In advanced industrial fields, technological advancement is progressing rapidly and technology trends are changing constantly. While high schools and ..
2023.04.17 by 명세환 기자
Autonomous cooperative driving, 5GAA and infrastructure security are essential
The activities of the 5G Automotive Association (hereafter 5GAA) and the importance of infrastructure security were highlighted in the advancement of ..
2023.04.17 by 성유창 기자
Mouser Expands Smart Farm Hub Through Resources for Engineers
As digital transformation rapidly takes place in agriculture, a traditional industry, the adoption of IT solutions in smart farms and horticulture is ..
2023.04.14 by 명세환 기자
Intel's Angstrom and Arm Core SoCs Join Forces
Intel Foundry Services (hereinafter IFS) and Arm announced a multi-generation collaboration plan enabling chip designers to create low-power computing..
2023.04.13 by 배종인 기자
Nepes Secures High-Density, Ultra-Thin 3D Packaging Technology
Advanced semiconductor back-end foundry specialist Nepes (CEO Lee Byung-gu) has secured high-density ultra-thin film 3D packaging technology applicabl..
2023.04.12 by 배종인 기자