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Asia's Largest Smart Factory and Automation Exhibition Concludes Success
Asia's largest smart factory and industrial automation specialized exhibition, 'Smart Factory·Automation Industry Expo 2021,' concluded successfully a..
2021.09.15 by 배종인 기자
Silicon Labs Announces Secure Sub-GHz SoC with 1-Mile Range
Silicon Labs announced on the 15th a new sub-GHz wireless SoC operating below 1GHz that supports long-range RF performance and energy efficiency while..
2021.09.15 by 이수민 기자
[China Briefing] China's YMTC Begins Shipping 64-Layer 3D NAND
Summary of notable China ICT news - September 15, 2021 [China Briefing]: ◇China's YMTC ships 64-layer 3D NAND, soon to mass-produce 128-layer QLC ◇Chi..
2021.09.15 by 이춘영 외신
ACM Secures Order for Wafer Equipment for Compound Semiconductors
ACM Research, Inc. has launched wafer-level packaging and plating support equipment for compound semiconductor manufacturing, and is reported to have ..
2021.09.14 by 배종인 기자
Applied Materials Unveils Two Types of SiC Wafer Equipment
SiC material is sensitive to native defects compared to Si, which can degrade electrical performance, power efficiency, reliability, and yield. Theref..
2021.09.14 by 이수민 기자
[Planning] Power & Sensors ② - Reliable Industrial Solutions for the Most Harsh Environments
Infineon is actively engaged in developing next-generation silicon and wide-bandgap power portfolios as well as cutting-edge sensor products, based on..
2021.09.14 by 명세환 기자
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Korea Hydro & Nuclear Power (KHNP) introduces 5G solution to restore power plant wired communication failures.
SK Telecom and Korea Hydro & Nuclear Power announced that they are moving forward with the adoption of a 'Private-5G based emergency communication sol..
2021.09.14 by 이수민 기자
Where to Start with AMR Design? Mouser Robotics Seminar 2021
Authorized distributor Mouser Electronics, which supplies the latest semiconductors and electronic components to the world, announced on the 13th that..
2021.09.13 by 명세환 기자
As demand for high-performance semiconductors grows, the importance of post-process packaging grows.
Packaging, a representative post-process in semiconductor manufacturing, is the process of encapsulating devices fabricated in the front-end process t..
2021.09.13 by 이수민 기자