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Full-scale fostering of the wearable industry, 127 billion won invested by 2020
The Ministry of Trade, Industry and Energy (Minister Yoon Sang-jik) and the Ministry of Future Creation and Science (Minister Choi Yang-hee) jointly w..
2015.11.27 by 신윤오 기자
Infineon Wins “SESAMES Award” in Two Categories
The internationally recognized "SESAMES Award" is presented for the most outstanding innovation in the digital security field in a given year. A panel..
2015.11.26 by 명세환 기자
Fitbit unveils new feature that automatically tracks exercise status
The innovative smart healthcare brand Fitbit, Inc. is introducing a new feature that enables Fitbit platform users worldwide to track their workouts c..
2015.11.24 by 명세환 기자
ams acquires image sensor company CMOSIS
ams, a specialist in high-performance analog ICs and sensors, announced that it has concluded an agreement to acquire 100% of the shares of CMOSIS, a ..
2015.11.24 by 명세환 기자
Xilinx Launches FPGA Family Useful for Diverse Connectivity
Xilinx announced the introduction of the Spartan®-7 FPGA product family, an I/O intensive device designed for cost-sensitive applications.
2015.11.24
Microchip Expands Low-Power MCU Family for the IoT
Microchip Technology announced an expansion of its portfolio of low-power PIC® microcontroller (MCU) product families. The new PIC24F 'GB6' product fa..
2015.11.24
[Editor's Notebook] The Reality of China's Semiconductor Rise Through IP Patents
In the semiconductor industry recently, China is undoubtedly the biggest issue. This is because the Chinese government has decided to invest approxima..
2015.11.23 by 신윤오 기자
Where Are We in Core Sensor Element Development? ② “Development of 79GHz Automotive Radar Sensor to Preempt the Autonomous Vehicle Market”
Following last week's updates on smart motion sensors, metabolic rate measurement sensors, harmful gas sensors, and optical sensors, we introduce the ..
2015.11.23 by 신윤오 기자
Toshiba Announces IC for Bluetooth Smart Devices with Built-in Flash ROM
Toshiba Corporation announced the launch of two Bluetooth ICs, "TC35676FTG/FSG" and "TC35675XBG", which support Bluetooth Low Energy (LE) 4.1 communic..
2015.11.20 by 신윤오 기자