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Nordic Launches Ultra-Low-Power Cellular IoT Solution nRF9151 SiP
Nordic Semiconductor, a global leader in low-power wireless IoT solutions, introduces a new cellular IoT solution featuring the lowest power consumpti..
2024.09.06 by 배종인 기자
“SK Hynix to mass produce HBM3E 12-layer products at the end of September”
SK Hynix CEO Kim Joo-sun (responsible for AI Infra) held a keynote address at SEMICON TAIWAN on the 4th with the theme "Unleashing the possibilities o..
2024.09.06 by 배종인 기자
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Satellite Communication Radio Environment Response Required...Radio Management Forum, Seeking Countermeasures for Low-Orbit Cluster Satellite Radio Management
As the low earth orbit satellite communication industry becomes more active, new issues regarding radio wave communications are emerging. With interna..
2024.09.05 by 권신혁 기자
SKT and SK Broadband Introduce 800Gbps High-Capacity Wired Network
SK Telecom (CEO Yong Sang Yoo) has proactively responded to the surge in data traffic from AI, cloud, and 5G by introducing 800Gbps-class high-capacit..
2024.09.04 by 배종인 기자
Vertiv, LS Materials Join Hands for Data Center Energy Solutions
Vertiv Korea has signed a strategic memorandum of understanding (MOU) with LS Materials, a leader in domestic ultracapacitor (UC) battery technology, ..
2024.09.04 by 배종인 기자
Mouser Delivers Latest Arduino Solutions for Engineers
Mouser Electronics, an authorized distributor supplying the latest electronic components and industrial automation products worldwide, is now supplyin..
2024.09.04 by 배종인 기자
Used hydrogen tube trailers owned by gas companies are for sale, adding cold water to the frozen hydrogen tube trailer market.
Industry insiders are concerned that if used hydrogen tube trailers owned by Korea Gas Corporation are actually put on the market at prices higher tha..
2024.09.04 by 배종인 기자
STM32 Summit held in Korea...STM32, the strength of 1 million developer ecosystem
The use of ST MCUs is becoming widespread across industries and products. Providing developer convenience is emerging as a core value for global chip ..
2024.09.04 by 권신혁 기자
“Magnetic Package, Heat, Power, EMI Advantages...Designer Inductor Concerns↓”
Size issues play a significant role in power design. In response, magnetic packaging (MagPack) technology has been unveiled, which can enhance EMI adv..
2024.09.02 by 권신혁 기자