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KIMM Sets Sail for Expansion into Eastern Europe
The Korea Institute of Machinery and Materials (KIMM, Director Ryu Suk-hyun) under the Ministry of Science and ICT has signed a five-party cooperation..
2024.09.23 by 배종인 기자
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KETI, the gateway to Czech battery and robot markets
The Korea Electronics Technology Institute (President Shin Hee-dong, hereinafter KETI) is taking the lead in industrial supply chain cooperation with ..
2024.09.23 by 배종인 기자
Mouser and Altium Partner to Develop Electronics Talent and Advance Education
Global authorized distributor Mouser Electronics announced on the 20th that it has established a new partnership with Altium, a global leading company..
2024.09.20 by 명세환 기자
Microchip Launches Graphics Suite Solution, Simplifying GUI Building
The integration of graphical user interfaces (GUI) into electronic devices is increasingly being adopted to enhance user experience by providing intui..
2024.09.20 by 명세환 기자
[Technical Interview] Kim Hyo-hoon, Infineon Manager, “Diversification of Vehicle Convenience Functions, ↑ Demand for Motors... Wide Range of Infineon Motor Solutions”
[Editor's Note] Among the mega trends in the automotive industry, implementing various functions that enhance vehicle convenience has emerged as the m..
2024.09.20 by 권신혁 기자
Standard Year Gas Measurement Group, “Development of Greenhouse Gas, Ozone, Exhaled Gas, and Green Energy Standard Materials Begins in Full Swing”
The Gas Measurement Group at the Korea Research Institute of Standards and Science has been accelerating new research efforts, including the developme..
2024.09.13 by 배종인 기자
NXP, Position, Presence, and Motion Detection Solved with One Chip
NXP Semiconductor has launched the industry's first single-chip solution that integrates on-chip processing capabilities, short-range UWB radar, and s..
2024.09.13 by 배종인 기자
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Korea Electric Power Research Institute, 'Diamond Power Semiconductor' International Cooperation Begins in Full Swing
The Korea Electrotechnology Research Institute (KERI) and Gyeongnam Province will jointly conduct international research with Orbray, a Japanese preci..
2024.09.13 by 배종인 기자
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ACM Expands Fan-Out Panel-Level Packaging Portfolio
ACM Research, a leading provider of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, has launched t..
2024.09.13 by 배종인 기자