전체기사7,120건
.jpg)
Intel Authorized Distributors 3, Happy Chuseok Intel Genuine CPU Quiz Promotion
Intel authorized distributors Intech&Company (CEO Seo Jung-wook), PC Direct (CEO Seo Dae-sik), and Coil (CEO Son Chang-jo) will conduct an 'Intel Genu..
2024.09.10 by 배종인 기자
.jpg)
Korea Electric Power Corporation (KEPCO) develops PVDF alternative battery binder
A joint research team led by Dr. Lim Hyun-kyun and Dr. Kang Dong-jun from the Insulation Materials Research Center at the Korea Electrotechnology Rese..
2024.09.10 by 배종인 기자
Air Products, Samsung Electronics Break Up, Reason for Withdrawal from Korea: 'Money'
Air Products, one of the world's three leading specialty gas companies, is being analyzed to have decided to withdraw from the Korean market despite l..
2024.09.09 by 배종인 기자
[STM32 Summit] Young-Hoo Lee, IAR Manager, “Applying Functional Safety SW Package Optimized for ST”
[Editor's Note] The use of ST MCUs across industries and products is becoming increasingly common. In particular, the STM32 product lineup has exceede..
2024.09.06 by 권신혁 기자
Nordic Launches Ultra-Low-Power Cellular IoT Solution nRF9151 SiP
Nordic Semiconductor, a global leader in low-power wireless IoT solutions, introduces a new cellular IoT solution featuring the lowest power consumpti..
2024.09.06 by 배종인 기자
“SK Hynix to mass produce HBM3E 12-layer products at the end of September”
SK Hynix CEO Kim Joo-sun (responsible for AI Infra) held a keynote address at SEMICON TAIWAN on the 4th with the theme "Unleashing the possibilities o..
2024.09.06 by 배종인 기자
SK Ecoplant, Full-scale Attack on Industrial Gas Market
SK Ecoplant is incorporating SK Materials Air Plus as a subsidiary, marking the beginning of full-scale entry into the industrial gas market.
2024.09.04 by 배종인 기자
STM32 Summit held in Korea...STM32, the strength of 1 million developer ecosystem
The use of ST MCUs is becoming widespread across industries and products. Providing developer convenience is emerging as a core value for global chip ..
2024.09.04 by 권신혁 기자
“Magnetic Package, Heat, Power, EMI Advantages...Designer Inductor Concerns↓”
Size issues play a significant role in power design. In response, magnetic packaging (MagPack) technology has been unveiled, which can enhance EMI adv..
2024.09.02 by 권신혁 기자