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TI Launches Standalone AEF IC… “Provides High Density, 3MHz or Less EMI Solution”
As wide bandgap compound semiconductors continue to gain market share in automotive, aerospace, and industrial applications, while these devices offer..
2023.04.18 by 명세환 기자
Sharing Security Management Strategies for Microchips and IoT Devices
Kwak Sang-shin, director at Microchip, will present on "IoT Device Security Lifecycle Management" at the "Microchip Tech Insight Korea" webinar on Apr..
2023.04.18 by 김예지 기자
TI's SimpleLink™ family of products enables efficient IoT connectivity.
Texas Instruments (hereinafter TI) has introduced the SimpleLink™ product family, designed to enable efficient IoT connectivity even in harsh environm..
2023.04.18 by 성유창 기자
[Serial] ST Yuji Kawano, Engineer (28) - Using GNSS Modules to Challenge Map Tracking! - GUI Edition (3)
Microcontrollers are unfamiliar compared to CPUs or GPUs, but they are among the most widely used semiconductors. Let's hear from Yuki Kawano, Manager..
2023.04.17 by 명세환 기자
Qualcomm Fine of 1.0311 Trillion Won for Abuse of Dominant Market Position Confirmed
Qualcomm's practice of restricting competition in the product market through licensing policies that violate FRAND commitments and exclusively enjoyin..
2023.04.14 by 배종인 기자
ROHM Develops Low ON Resistance, High Efficiency Operation Nch MOSFET
ROHM has developed 13 products (40V/60V/80V/100V/150V) in the Nch MOSFET 'RS6xxxxBx/RH6xxxxBx series' optimized for driving applications operating as ..
2023.04.13 by 배종인 기자
IAR Launches IAR Embedded Secure IP Solution
IAR, a global provider of software and services for embedded development, has released IAR Embedded Secure IP, which enables developers to easily add ..
2023.04.13 by 배종인 기자
Advancing Discussion on Building Advanced Semiconductor Technology Center
Industry, academia, and research experts have gathered to discuss the construction plan for the 'Korean Advanced Semiconductor Technology Center'.
2023.04.13 by 배종인 기자
Nepes Secures High-Density, Ultra-Thin 3D Packaging Technology
Advanced semiconductor back-end foundry specialist Nepes (CEO Lee Byung-gu) has secured high-density ultra-thin film 3D packaging technology applicabl..
2023.04.12 by 배종인 기자