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[Interview] Lee Kyung-soo, Manager at Infineon: "AURIX™ Automotive Security: Safe and Rapid Implementation"
Infineon Korea, a global company supplying diverse security product lines for automotive and industrial IoT applications, shared insights on automotiv..
2022.01.24 by 배종인 기자
[Interview] Codeju CEO Jang Byeong-nam - “Designing AWS Cloud Service with Communications Unaffected by the Surrounding Environment”
We arranged an interview with Jang Byung-nam, CEO of Code Zoo, to learn about LTE Cat.M1, an LTE-based communication method for Internet of Things dev..
2022.01.24 by 김예지 기자
Intel to Invest $20 Billion in Ohio Semiconductor Fab
Intel has taken the first step of its $100 billion investment plan over the next decade by committing an additional $20 billion to establish two more ..
2022.01.24 by 배종인 기자
SK Materials Achieves Industry-First Carbon Footprint
SK Materials, a materials company specializing in semiconductors and displays (CEO Lee Gyu-won), has obtained carbon footprint certification as the fi..
2022.01.21 by 배종인 기자
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“Parts are extremely difficult to come by, there is no 1K resistance”
Domestic component manufacturers are facing difficulties as production is disrupted by severe component shortages, with some components experiencing s..
2022.01.21 by 배종인 기자
TI Unveils Industry's Highest Bandwidth Amplifier
Texas Instruments (hereinafter TI) is introducing amplifiers that eliminate the need for custom ASICs and simplify front-end design, responding to eng..
2022.01.21 by 성유창 기자
ASML's 2021 revenue reached €18.6 billion, up 33% year-over-year.
ASML, which supplies extreme ultraviolet (EUV) lithography equipment to Samsung Electronics and SK Hynix, achieved high growth exceeding 30% in 2021 a..
2022.01.20 by 성유창 기자
ASML Announces Intel as First Hign-NA Customer
Intel, which had announced plans last July to produce products based on '18A' in 2025, has moved a step closer to realizing those plans by placing an ..
2022.01.20 by 성유창 기자
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Hilscher Launches comX Module Optimized for Semiconductor Equipment
Hilscher responds to semiconductor factory production expansion demands by developing a communication module that allows easy specification of interop..
2022.01.19 by 배종인 기자