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How Can Analog Technological Capabilities, Still Important, Be Developed?
Analog technology is not a relic of the past. All physical elements such as audio signals or temperature are analog values. Analog technology is requi..
2019.10.09 by 이수민 기자
Microchip Launches Bluetooth 5.0 Certified Dual-Mode IC and Module
Microchip Technology has launched the IS2083, a Bluetooth 5.0 certified dual-mode audio IC, and the BM83 module, which has received certification with..
2019.10.08 by 이수민 기자
The 50th Korea Electronics Show 2019, celebrating the 60th anniversary of the Korean electronics industry, opens.
The 50th Korea Electronics Show 2019, commemorating the 60th anniversary of South Korea's electronics industry, will be held from the 8th to the 11th ..
2019.10.08 by 이수민 기자
Samsung Electronics Creates 24GB HBM with 12-Layer 3D-TSV Technology
Samsung Electronics has developed 12-layer 3D through-silicon via (3D-TSV) technology. 12-layer 3D-TSV is a packaging technology that instead of conne..
2019.10.07 by 이수민 기자
With 5G Commercialization One Year Ahead, Where Is Korea Heading?
# Translation 5G mobile communications are steadily expanding in Korea and several other countries. Gartner projected that global 5G mobile infrastru..
2019.10.06 by 이수민 기자
Maxim Launches Buck-Boost Converter with 98% Peak Efficiency and 6μA Quiescent Current
Maxim Integrated Korea announced the MAX77827, a buck-boost converter that achieves 96% peak efficiency and 6μA standby current. The newly announced b..
2019.10.04 by 명세환 기자
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Xilinx Launches Vitis, an Integrated Software Platform for Adaptive Hardware
Xilinx announced the launch of Bytis, an integrated design platform for software and hardware engineers. Bytis is a unified software platform that aut..
2019.10.04 by 명세환 기자
Microchip simplifies hardware-based IoT security with pre-provisioning solution
Hardware-based security is the only method that can protect secret keys from physical attacks and remote data extraction. However, setting up and prov..
2019.10.04 by 이수민 기자
NXP Announces All-in-One 5G mMIMO RF Power Amplifier Module
NXP has announced an RF integrated solution with a PCB that is 5 times smaller compared to conventional RF designs. This RF power multi-chip module ca..
2019.10.04 by 명세환 기자