전체기사7,120건
Cognex Korea Expands Office Relocation to Expand Customer Support
Cognex has expanded and relocated the Cognex Korea office to DaeMyung Tower, 135 Beobwon-ro, Songpa-gu, to accommodate organizational growth in line w..
2017.08.03 by 김자영 기자
Microchip Launches MCU Providing Hardware-Based Security Suitable for Automation and IoT
Microchip Technology announced the launch of the SAM D5x and SAM E5x microcontroller (MCU) product families. These new 32-bit MCU families offer broad..
2017.08.02 by 김지혜 기자
ADI Releases DAC Supporting Wired Communication Systems
Analog Devices (ADI) has introduced a pair of highly integrated 16-channel DACs that significantly reduce the footprint of wired communication systems..
2017.08.01 by 김지혜 기자
Mouser to Stock Infineon's Industrial XMC1400 MCUs
Mouser Electronics supplies industrial microcontrollers (MCU) from Infineon Technology's XMC1400 series. The XMC1400 series devices, which belong to ..
2017.08.01 by 김자영 기자
Intel Authorized Dealer, Intel X-Series Processor Launch Commemorative Event
Three authorized Intel distributors (Coit, PC Direct, and Intek & Company) have announced that they will conduct a quiz event along with teaser videos..
2017.08.01 by 김자영 기자
Will UFS mobile memory rapidly expand beyond smartphones into various markets?
"In high-end mobile devices, UFS will replace eMMC's position." At the 'Mobile & IoT Forum 2017' held on the 28th at Elltower in Yangiae, hosted by t..
2017.08.01 by 김지혜 기자
NXP Establishes Partnership with AWS to Address IoT Security Issues
# Integration of Amazon Greengrass with NXP Gateway Platform NXP is entering into collaboration with Amazon Web Services (AWS) in the IoT sector. NX..
2017.07.31 by 김지혜 기자
Maxim Unveils Power Management Semiconductor Reduced by Half
Maxim Integrated Korea announced new power management semiconductors (PMICs) 'MAX77650' and 'MAX77651'. The two products can enhance battery life and..
2017.07.28 by 김지혜 기자
Western Digital Unveils X4 Architecture Based on 64-Layer 3D NAND
Western Digital has unveiled an X4 (4-bit per cell) flash memory architecture based on BiCS3, a 64-layer 3D NAND technology. The BiCS3 X4 technology ..
2017.07.28 by 김지혜 기자