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Daewon CTS Expands Micron Crucial MX300 Product Lineup
SSD interfaces are divided into the widely used SATA and M.2 (NGFF), which is preferred for ultra-slim notebooks and high-end PCs. SATA-based SSDs ha..
2016.07.29 by 김수지 기자
AMD Unveils Graphics Card with Terabyte-Level Memory
AMD unveiled the 'Radeon™ Pro SSG (Radeon™ Pro SSG)', a graphics solution for large-scale dataset applications, at SIGGRAPH 2016 held in Anaheim, Cali..
2016.07.29 by 김수지 기자
Molex Korea Launches Receptacle Providing Integrated TPA
Korea Molex (CEO Jae-hoon Lee) has launched a Micro-Fit™ TPA type single-row receptacle that provides a TPA completely integrated into the housing. Th..
2016.07.29 by 장은성 기자
Dassault Systèmes conducts industry-academia joint research on automotive component and material technology development
Dassault Systèmes Korea (CEO Cho Young-bin) held an MOU (Memorandum of Understanding) signing ceremony today at Sungkyunkwan University's Second Engin..
2016.07.28 by 홍보라 기자
ON Semi Launches Power Integrated Module Solution for Next-Generation Automotive BLDC
ON Semiconductor (Nasdaq: ON) has expanded its automotive Power Integrated Modules (PIMs) product line with the introduction of the STK984-190-E. Opt..
2016.07.28 by 홍보라 기자
Samsung Electronics reports strong second-quarter performance across various sectors, including mobile displays
Samsung Electronics announced its Q2 2016 results on the 28th, reporting consolidated revenues of 50.94 trillion won and operating profit of 8.14 tril..
2016.07.28 by 신윤오 기자
Toshiba Ships Samples of 64-Layer 3D Flash with Increased Capacity via Added Stacking
Toshiba Corporation has unveiled next-generation BiCS FLASH™ three-dimensional (3D) flash memory with a stacked cell structure*. Sample shipments of ..
2016.07.28 by 신윤오 기자
Silicon wafer shipments in the second quarter rose 6.6% from the previous quarter
The Semiconductor Equipment and Materials International (SEMI) recently announced in its global wafer industry quarterly report that silicon wafer shi..
2016.07.27 by 김수지 기자
North American semiconductor equipment shipments hit their highest level since February 2011.
According to the June BB ratio report released by SEMI (Semiconductor Equipment and Materials International), the three-month average bookings for Nor..
2016.07.25 by 김수지 기자