전체기사7,120건
Samsung Electronics Mass-Produces Ultra-High-Speed, Smallest Form Factor BGA NVMe SSD
Samsung Electronics has announced the launch of the world's smallest and lightest BGA NVMe SSD, weighing only 1 gram (g) and measuring just 2 centimet..
2016.06.01 by 명세환 기자
Tektronix Introduces 3rd and 4th Gen Serial Bus Certification Testing for Highest Performance Oscilloscopes
Tektronix has recently announced new optional software features that enable serial bus standard testing support for its high-performance oscilloscope ..
2016.05.31 by 명세환 기자
[Company Review] Iron Device, a Powerhouse in Audio Semiconductors
Iron Devices Inc. is a fabless semiconductor company specializing in single-chip system semiconductors that integrate analog, digital, and power funct..
2016.05.31 by 신윤오 기자
ARM Delivers Amazing Immersive VR and AR Experiences to 2017 Flagship Mobile Devices
ARM has unveiled premium mobile processor technology that will redefine flagship devices from 2017 onwards. Manufacturers can develop products that de..
2016.05.30 by 명세환 기자
Domestic CPU cores target image recognition of autonomous cars
Aldebaran CPU core has been developed by Electronics and Telecommunications Research Institute (ETRI) independently. Companies can acquire Aldebaran C..
2016.05.30
Multi-connectivity chip developers, capture the smart home IoT market
With the smart home market based on IoT (Internet of Things) expected to experience rapid growth, interest in IoT connectivity communication technolog..
2016.05.27 by 신윤오 기자
Lattice Announces Programmable Bridging Device Suitable for VR Drones and More
Lattice Semiconductor (Branch Manager Lee Jong-hwa) has announced the industry's first Lattice CrossLink programmable bridge device that supports key ..
2016.05.27 by 명세환 기자
Xilinx Expands 16nm UltraScale+ Product Roadmap for Data Centers
Xilinx announced an expansion of its 16nm UltraScale+™ product roadmap for data centers. The roadmap includes new acceleration-enhanced technologies...
2016.05.27 by 명세환 기자
Semiconductor equipment manufacturers' orders increase, reflecting 3D NAND and Chinese investments.
According to the April BB ratio report released by the Semiconductor Equipment and Materials International (SEMI), North American semiconductor equipm..
2016.05.26 by 명세환 기자