Intel Accelerates Open Ecosystem for Developers
Amid fierce competition in the IT industry, Intel demonstrated its willingness to energize the developer community through an open platform and provid…
2022.09.29 by 명세환 기자
AMD Launches Ryzen Embedded V3000 Series Processors
AMD announced on the 28th that it has launched the Ryzen Embedded V3000 series processors by adding high-performance Zen 3 cores to its V-series portf…
2022.09.28 by 명세환 기자
Pet Gelsinger: "UCIe is just around the corner."
As heterogeneous integration semiconductors emerge as next-generation technology, more cases of adopting chiplet architecture are increasing. In respo…
2022.09.28 by 명세환 기자
IAR Fully Supports Renesas RZ/T2 and RZ/N2 Series MPUs
Today, the requirements needed in industrial applications are becoming increasingly complex year after year. Performance requirements are also rising,…
2022.09.16 by 명세환 기자
Optimizing Mobile 3D Visual Experience
This year, the global mobile game market is expected to reach a scale of $222 billion (approximately 287 trillion won in Korean currency), with mobile…
2022.06.29 by 명세환 기자
NVIDIA Announces Launch of Grace CPU Superchip in First Half of 2023
NVIDIA's presence has been notable at Computex 2022, the international ICT trade show held in Taiwan. In its keynote address, NVIDIA positioned itself…
2022.05.25 by 명세환 기자
As demand for high-performance semiconductors grows, the importance of post-process packaging grows.
Packaging, a representative post-process in semiconductor manufacturing, is the process of encapsulating devices fabricated in the front-end process t…
2021.09.13 by 이수민 기자
New Intel Xeon W-3300, Supporting Input/Output Intensive Workloads
Intel has launched the Intel Xeon W-3300 processor family for workstation professionals. This high-performance single-socket solution with enterprise-…
2021.08.02 by 이수민 기자
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ST Announces ML-Enhanced 'STM32Cube.AI 7.0' Development Environment
ST Microelectronics has announced an expansion of machine learning techniques available in the STM32Cube.AI development environment. The new STM32Cube…
2021.07.29 by 강정규 기자
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[China Briefing] Huawei Confirms Partner, Accelerates Automotive Business
e4ds News China-Taiwan-Hong Kong ICT Briefing - July 28, 2021 [China Briefing] : ◇Huawei confirms Beijing Auto, Guangzhou Auto, and Changan Auto as au…
2021.07.28 by 이춘영 외신
Intel CEO: "Number of nanometers is just a marketing slogan" as foundry business launches
Intel introduced naming conventions such as "Intel 7/4/3/20A" to enable customers to accurately understand nano-scale processes, acknowledging that na…
2021.07.27 by 이수민 기자
Intel's Q2 revenue exceeds forecast as PC demand continues to rise.
Intel announced second quarter results with revenue of $19.6 billion and operating profit of $5.1 billion, surpassing expectations. PC segment revenue…
2021.07.23 by 이수민 기자
"Will a mobile AlphaGo come out?" KAIST develops high-efficiency AI semiconductor
Professor Yu Hoe-jun's team at KAIST announced that they have developed semiconductor technology capable of processing deep reinforcement learning (DR…
2021.07.16 by 이수민 기자
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TI Unveils High-Performance MCU to Advance Edge Applications
As industrial automation, next-generation automotive, intelligent analytics, and connectivity requirements intensify, demand for fast and accurate MCU…
2021.07.15 by 이수민 기자
[China Briefing] Will TSMC's first 3nm product be the iPad?
e4ds News Summary of China ICT News - July 8, 2021 [China Briefing]: ◇Apple and Intel expected to adopt TSMC 3nm technology first ◇EU to establish inv…
2021.07.08 by 이수민 기자