Memory semiconductor integration will increase 1,000 times compared to now
Professor Lee Jun-hee's research team at UNIST has presented a principle that can increase the integration density of memory semiconductors by more th…
2020.07.03 by 이수민 기자
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SK Hynix Begins Mass Production of Next-Generation Memory "HBM2E"
SK Hynix has begun full-scale mass production of HBM2E. This is faster than Samsung Electronics, which announced mass production within this year, as …
2020.07.03 by 강정규 기자
Signs of a surge in investment in memory, image, and power semiconductor equipment are emerging.
According to SEMI's World Fab Forecast report, semiconductor fab equipment investment in 2021 is projected to reach $67.7 billion, representing approx…
2020.06.10 by 강정규 기자
Samsung Electronics, 'Memory Super-gap', Expands NAND Flash Production Lines
Samsung Electronics announced that it is proceeding with cleanroom construction for the Pyeongtaek Line 2 NAND flash facility starting in May, with pl…
2020.06.01 by 이수민 기자
Strong Q1 Despite COVID-19, Q2 Uncertain... Samsung Electronics Announces Q1 2020 Earnings
Samsung Electronics announced first quarter 2020 results with revenue of 55.33 trillion won and operating profit of 6.45 trillion won. First quarter r…
2020.04.29 by 이수민 기자
In the 2019 semiconductor equipment market, Taiwan rose, while Korea fell.
Global semiconductor equipment sales in 2019 totaled $59.8 billion, representing approximately a 7% decline from $64.5 billion in 2018. Taiwan emerged…
2020.04.16 by 이수민 기자
Samsung Electronics Establishes Mass Production System for 1st Generation 10nm-Class EUV DRAM
Samsung Electronics has supplied one million units of its first-generation 10-nanometer-class DDR4 DRAM modules produced using EUV process technology …
2020.03.25 by 최인영 기자
MicroSD card capable of 120,000 hours of recording released
Western Digital has launched a new SanDisk Max Endurance microSD card with high durability designed for automotive dash cams and home monitoring syste…
2020.03.23 by 이수민 기자
Release of Encryption-Supported MCU Blocking Rootkit and Bootkit Malware
Microchip Technology has unveiled the CEC1712, a cryptography-enabled MCU model that can block malicious malware such as rootkits and bootkits for sys…
2020.03.19 by 최인영 기자
Samsung Electronics Mass-produces eUFS 3.1, Twice as Fast as SATA SSD
Samsung Electronics has announced mass production of 512GB eUFS 3.1 for smartphone memory. The 512GB eUFS 3.1, which significantly expands sequential …
2020.03.17 by 이수민 기자
Mentor & Siemens Platforms Introduced for Custom Circuit Verification and Equipment Noise Analysis
Artificial intelligence processor company Mythic has adopted Mentor Siemens' platform for functional verification of analog and digital logic integrat…
2020.02.26 by 최인영 기자
Samsung Electronics begins mass production of industry-first 16GB mobile DRAM.
Samsung Electronics has begun mass production of 16GB LPDDR5 mobile DRAM. The 16GB mobile DRAM package is equipped with eight 12Gb (=1.5GB) chips and …
2020.02.25 by 이수민 기자
WD Unveils Embedded UFS 3.1 for 5G Smartphones
Western Digital has unveiled the embedded UFS device iNAND MC EU521. The EU521 is optimized for 5G applications and performance by applying the write …
2020.02.21 by 이수민 기자
Success in localizing hard mask materials for memory semiconductors
DCT Material and the Nano Convergence Technology Center announced successful technological independence in spin-coating hard mask materials for memory…
2020.02.13 by 이수민 기자
Global Semiconductor Equipment Market to Continue to Grow by 2025
The global semiconductor equipment market is projected to record an annual growth rate of 9% through 2025, driven by growth in the consumer electronic…
2020.02.13 by 최인영 기자