TI’s DLP Chipset for Automotive HUDs Provides Industry’s Largest Field of View (Enabling Head-Up Displays (HUDs) Providing the Industry’s Largest 12-Degree Field of View (FOV))

I is launching DLP3000-Q1, a DLP chipset for automotive head-up display (HUD) applications, marking the company's first offering in this segment. Thi…

2015.05.21 by 박동욱 기자