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430 trillion AI semiconductor market, memory growth is key
As the AI revolution triggered by generative AI accelerates the proliferation of AI capabilities and software tools, the market is expanding further i…
2024.11.25 by 권신혁 기자
SK Hynix to mass produce world's highest 321-layer NAND in the first half of next year
SK Hynix has entered mass production of 321-layer 1Tb (terabit) TLC (Triple Level Cell) 4D NAND flash, which is the world's highest layer count, compl…
2024.11.21 by 배종인 기자
Next-generation memory in the on-device AI era, PIM-LPDDR6 combination expected in mobile
Generative AI has triggered increased attention on SK Hynix's HBM due to AI server expansion and datacenter infrastructure upgrades. In this context, …
2024.11.19 by 권신혁 기자
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Solidigm Launches World's Largest Capacity AI NAND 122TB eSSD 'D5-P5336'
Solidigm, a subsidiary of SK Hynix, has launched a 122TB (terabyte) AI NAND eSSD with the world's largest capacity, and is expected to become a game c…
2024.11.14 by 배종인 기자
Semiconductor industry's 'AI' life or death
SK Group will hold the 'SK AI Summit 2024' on the 4th, Samsung Electronics will host the 'Samsung AI Forum 2024' on the 4th and 5th, and Arm will hold…
2024.11.05 by 배종인 기자
SK Hynix President Kwak No-jeong: "We will lead AI with world-first, best-in-class, and optimal innovation technology."
SK Hainik's President and CEO Kwak No-jung stated during his keynote speech at 'SK AI Summit 2024' that "we will lead the AI era with our technologica…
2024.11.04 by 배종인 기자
Chairman Choi Tae-won, “AI Success Use Cases, AI Accelerators, Energy Issues Must Be Overcome”
SK Chairman Chey Tae-won stated in a keynote speech at the 'SK AI SUMMIT 2024' that artificial intelligence (AI) must overcome success cases utilizing…
2024.11.04 by 배종인 기자
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SK Hynix Vice President Lee Kang-wook's confidence... "HBM = Hynix's best memory"
The critical keyword in the AI era is large-scale data processing. From next-generation HBM4 onwards, we are preparing for changes through hybrid bond…
2024.10.25 by 권신혁 기자
SK Hynix Shows Off World's First 12-Layer 36GB HBM3E Overwhelming Technology
SK Hynix becomes the first in the world to mass-produce HBM3E 12-stack new products implementing 36GB (gigabytes), the current maximum capacity of HBM…
2024.09.26 by 배종인 기자
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SK Hynix Develops High-Performance SSD 'PEB110 E1.S' for Data Centers
The expansion of AI services and cloud domains, along with increased data generation and higher capacity requirements, are inevitably leading to wides…
2024.09.11 by 명세환 기자
“SK Hynix to mass produce HBM3E 12-layer products at the end of September”
SK Hynix CEO Kim Joo-sun (responsible for AI Infra) held a keynote address at SEMICON TAIWAN on the 4th with the theme "Unleashing the possibilities o…
2024.09.06 by 배종인 기자
“SK Hynix to launch HBM4 12-layer in 2025”
Lee Kang-wook, Senior Vice President of SK Hynix (in charge of PKG Development), delivered a presentation at SEMICON TAIWAN on the 3rd with the theme …
2024.09.04 by 배종인 기자
“Evolution of on-device AI in automobiles requires high-performance and high-capacity memory”
Kang Wook-sung, Vice President of SK Hynix, delivered a presentation on "The Direction of Intelligent Vehicle Memory-Storage Development in the AI Era…
2024.08.14 by 배종인 기자
SK Hynix Takes Action to Secure Masters and Doctoral Talents
SK Hynix will conduct 'Tech Day 2024' at five domestic engineering universities from the 20th through September 10th to secure outstanding semiconduct…
2024.08.12 by 배종인 기자
S&P Upgrades SK Hynix Credit Rating
International credit rating agency Standard & Poor's (S&P) upgraded SK Hynix's corporate credit rating by one notch from the previous 'BBB-' to 'BBB'.
2024.08.08 by 배종인 기자