TI, 'Power Module' Magnetic Packaging Technology Doubles Power Density and Increases Efficiency by 2%
Texas Instruments (TI) has achieved double the power density while maintaining superior thermal performance with new power modules featuring MagPack™ …
2024.10.15 by 배종인 기자
.jpg)
TI, Go from concept to prototype in minutes with no-coding tools
Texas Instruments (TI) has launched a new Programmable Logic Device (PLD) that enables implementation from concept to prototype in just a few minutes,…
2024.10.15 by 배종인 기자
“Magnetic Package, Heat, Power, EMI Advantages...Designer Inductor Concerns↓”
Size issues play a significant role in power design. In response, magnetic packaging (MagPack) technology has been unveiled, which can enhance EMI adv…
2024.09.02 by 권신혁 기자
.jpg)
TI Implements 4K Projector with 90% Smaller DLP® Display Controller
Texas Instruments (TI) has enabled compact designs for consumer applications such as lifestyle or gaming projectors and augmented reality glasses with…
2024.08.28 by 배종인 기자
.jpg)
Mouser to Supply TI DLP2021-Q1 DLP Digital Micromirror
Mouser Electronics, an authorized distributor supplying the latest electronic components and industrial automation products worldwide, is now offering…
2024.08.21 by 배종인 기자
Edge AI (10) - Jo Seok-young, Nota Manager ②, “On-device AI that knows ‘context’ based on generative AI is on the rise”
We met with Manager Cho Seok-young of Nota Corporation (hereinafter Nota), which has been drawing industry attention for its on-device AI optimization…
2024.08.09 by 권신혁 기자
Infineon's InnoScience GaN Patent Lawsuit, Not Just a Litigation, but Future AI and Data Center Markets at Risk
The patent infringement lawsuit between global semiconductor company Infineon Technologies and China's Innoscience is analyzed to become an important …
2024.08.08 by 배종인 기자
Electric vehicle battery fires: realistic BMS management is more important than emotional response
As fear of electric vehicles grows in the wake of the recent fire incident involving an electric vehicle in Cheongna, there is growing consensus that …
2024.08.06 by 배종인 기자
TI Launches Power Module with Magnetic Materials for Increased Power Density and EMI Decreased
Texas Instruments (TI) has launched a new power module that applies magnetic materials to reduce size by 50% compared to existing products, increasing…
2024.08.06 by 배종인 기자
.jpg)
Automotive semiconductors increasingly dependent on advanced foundries
As vehicles advance with technologies such as Software Defined Vehicle (SDV) and electrification in the future, the level of semiconductor technology …
2024.07.18 by 배종인 기자
Rapid Growth in DSP Market, High Adoption in IoT and Connected Devices
The digital signal processor (DSP) market continues to expand with advances in cutting-edge technology and industrial development. Growing demand for …
2024.07.08 by 권신혁 기자
TI Creates 11kW Onboard Charger Combining Delta MCUs with TI EMI Filters
Texas Instruments (TI) and Delta Electronics, a global power and energy management manufacturer, have joined forces to advance electric vehicle onboar…
2024.06.28 by 배종인 기자
TI Unveils Industry’s First GaN IPM… Solving Home Appliance Market Needs at Once
Texas Instruments (hereinafter TI) has launched an intelligent power module (IPM) utilizing GaN technology that can simultaneously address market dema…
2024.06.13 by 성유창 기자
TI pioneers processing technology for all applications, including robotics, energy, and automotive.
Texas Instruments (TI) announced that it will demonstrate new embedded processing and connectivity products to enable a safer, smarter, and more susta…
2024.03.15 by 배종인 기자
TI, responding to rapidly increasing memory bandwidth and speed…supporting achievement of power density that exceeds limits
Texas Instruments (hereinafter TI) held a presentation to share its portfolio featuring distinctive advantages in power density in response to the rap…
2024.03.05 by 성유창 기자