Global fab equipment investment will decline this year but increase next year.
According to SEMI's latest Global Fab Outlook report, global fab equipment investments in 2019 are expected to decline 19% year-over-year to $48.4 bil…
2019.06.12 by 이수민 기자
Potential to dramatically increase the speed and capacity of next-generation memory semiconductor MRAM discovered
Professor Jung Myung-hwa's research team at Sogang University has demonstrated the potential to further advance the speed and storage capacity of magn…
2019.06.10 by 이수민 기자
Infineon Launches CoolSiC Schottky 1200V G5 Diodes
Infineon Technologies has launched the CoolSiC Schottky 1200V G5 diode available in a TO247-2 package. The new product achieves higher efficiency by r…
2019.06.10 by 이수민 기자
AI device operating at the speed of light has been developed
A research team led by Professor Park Nam-gyoo, Dr. Yu Seon-gyoo, and Dr. Park Hyun-hee at Seoul National University has successfully demonstrated the…
2019.06.08 by 이수민 기자
Mouser now stocks Maxim's MAX77860 switch-mode step-down charger for portable applications.
Mouser Electronics supplies Maxim's MAX77860 switch mode buck charger. Combining high performance, wide input voltage range, and USB Type-C CC detecti…
2019.06.07 by 이수민 기자
ADI Launches mmWave 5G Network Infrastructure Support Solution
Analog Devices has launched a solution for mmWave 5G wireless network infrastructure. Achieving a high level of integration to alleviate the design re…
2019.06.04 by 이수민 기자
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Reducing Hidden Costs When Designing Next-Generation Insulation Solutions
Electronic device systems are becoming increasingly compact and lightweight. The need for isolation between various electronic devices and systems is …
2019.06.04 by 이수민 기자
Global semiconductor equipment shipments in Q1 2019 fell 8% compared to the previous quarter
SEMI announced on the 3rd that global semiconductor manufacturing equipment shipments in the first quarter of 2019 fell approximately 8% from the prev…
2019.06.04 by 이수민 기자
Toshiba Launches Low-Power Brushed DC Motor Driver IC
Toshiba has launched the brushed DC motor driver IC 'TB67H450FNG'. With a maximum rating of 50V/3.5A, the TB67H450FNG drives motors across a wide oper…
2019.06.04 by 이수민 기자
The surge in IDC traffic in the 5G era… FPGAs are the answer.
The importance of data centers and the utilization rate of IoT devices have increased significantly in recent years. Consequently, the demand for FPGA…
2019.06.03 by 이수민 기자
Microchip Launches Terabit-Range Ethernet PHY Family for Data Centers
Microchip Technology has launched the META-DX1 Ethernet PHY device family through its subsidiary Microsemi for cloud and telecommunications service pr…
2019.06.03 by 이수민 기자
Samsung Electronics Unveils Two Types of Power Delivery Control Semiconductors That 'Determine Device Status to Supply Optimal Power'
Power delivery control semiconductors are embedded in chargers and select either fast or standard charging modes based on the specification certificat…
2019.05.29 by 이수민 기자
Siemens Announces PAVE360, New Validation Program to Lead the Popularization of IC Design and Development for Autonomous Vehicles
Siemens introduced PAVE360, a pre-silicon autonomous validation program designed to accelerate the development of autonomous vehicle platforms. PAVE36…
2019.05.29 by 이수민 기자
[Computex 2019] Intel Enhances PC Experience by Expanding CPU Diversity and Specializing in Differentiation
Intel will showcase a diverse range of products and technologies that comprehensively cover PC industry trends together with its partners at Computex …
2019.05.28 by 이수민 기자
ADI Unveils Two New Products in May… Ultra-Low Noise Frequency Synthesizer ADF41513 and PMU ADP1031
ADI has unveiled two new products in May. The ADF41513 is an ultra-low noise frequency synthesizer that can be used to implement local oscillators at …
2019.05.27 by 이수민 기자