Global semiconductor equipment shipments in Q1 2019 fell 8% compared to the previous quarter
Published2019.06.04 09:01| South Korea, down 8% from the previous quarter and
Decrease of 54% compared to the same period last year
SEMI (Semiconductor Equipment and Materials International) announced on the 3rd that global semiconductor manufacturing equipment shipments in the first quarter of 2019 amounted to $13.79 billion, down about 8% from the previous quarter.
This is a decrease of about 19% compared to the shipment value of $16.99 billion in the first quarter of 2018, the same period of the previous year.
In the Korean market, semiconductor manufacturing equipment shipments in the first quarter of 2019 fell 8% from the previous quarter to $2.89 billion, and decreased by approximately 54% compared to the same period of the previous year.
Quarterly shipments by region and growth rates compared to the previous quarter and the same period last yearv>
The shipment figures announced by SEMI were based on data collected on a monthly basis from more than 80 global equipment companies in collaboration with the Semiconductor Equipment Association of Japan (SEAJ).
Meanwhile, the Equipment Market Data Subscription (EMDS), which includes global semiconductor manufacturing equipment shipments, is a source that compiles and provides information on the global semiconductor equipment market.
It consists of reports reflecting monthly trends in the semiconductor equipment market, Worldwide Semiconductor Equipment Market Statistics (WWSEMS) reports on semiconductor equipment shipments for 7 regions and 24 markets, and SEMI semiconductor equipment market outlook reports.
Related news
Institute for Basic Science Successfully Synthesizes 2D White Graphene "Path Opened to Commercialization of Rollable Displays"
The Feng Ding Group Leader team at the Institute for Basic Science's Multidimensional Carbon Materials Research Unit has developed key technology for commercializing low-power, high-performance rollable displays that roll up like newspapers, in collaboration with research teams from China and Switzerland. The research team has successfully manufactured single-crystal 2D white graphene, which previously had a manufacturing limit of just a few square millimeters, at a large area of up to 100 cm². This is a size that can be directly applied to semiconductor manufacturing processes. 2D white graphene is a 2D material with a thickness of 1-2 atomic layers in which boron and nitrogen atoms are arranged in a triangular form. Unlike graphene, it possesses insulating properties and can be applied as a 2D insulator. The Ministry of Science and ICT and the Institute for Basic Science announced that the research results were published online in Nature, the world's most prestigious academic journal, on May 23.
2019.05.23by 이수민 기자
Samsung Electronics Unveils Two Types of Power Delivery Control Semiconductors That 'Determine Device Status to Supply Optimal Power'
Power delivery control semiconductors are embedded in chargers and select either fast or standard charging modes based on the specification certification status between electronic devices and chargers as well as current charging levels, supplying optimal power. Samsung Electronics unveiled power delivery control semiconductors MM101 and SE8A on the 28th, supporting the latest fast charging standard USB-PD 3.0. When a charger is connected to an electronic device, MM101 and SE8A identify whether both parties are genuine products certified to the USB-PD 3.0 standard specification, enabling fast charging only under predetermined conditions. Additionally, a solution that blocks charging when moisture or foreign substances are present at the cable connector has been integrated to enhance safety.
2019.05.29by 이수민 기자
The surge in IDC traffic in the 5G era… FPGAs are the answer.
The importance of data centers and the utilization rate of IoT devices have increased significantly in recent years. Consequently, the demand for FPGAs is gradually rising in various application fields that previously relied mainly on conventional processors. This is because FPGAs offer better efficiency than traditional processors for specialized purposes. Agilex, the first FPGA released by Intel following its acquisition of Altera, has drawn attention as a semiconductor manufactured using Intel's 10nm process. An even more interesting aspect is that it supports CXL specifications, a recently disclosed next-generation interface standard, as well as PCIe 5.0. Agilex can secure sufficient bandwidth even when used alongside dedicated accelerators such as CPUs and GPUs. Moreover, it not only supports ultra-high-speed memory such as DDR5 and HBM2, but also supports Intel Optane DC Persistent Memory.
2019.06.03by 이수민 기자
Intel Unveils Next-Generation 'Core Ultra Series 3' and vPro Platform for Enterprise PCs
Intel has officially unveiled the "Intel Core Ultra Series 3" for next-generation enterprise PCs and the latest vPro platform, addressing a wide range of demands from enterprise notebooks to high-performance workstations.
2026.03.26by 배종인 기자
ROHM Launches ESD Protection Diode Compatible with High-Speed Interfaces of 10Gbps or Higher
Semiconductor specialist ROHM has developed the 'RESDxVx series' of ESD (electrostatic discharge) protection diodes capable of responding to next-generation high-speed data communication environments exceeding 10Gbps, simultaneously enhancing both signal quality maintenance required in high-speed interfaces and IC protection performance.
2026.03.26by 배종인 기자
