Semiconductor investment momentum shifts from front-end to back-end
The flow of semiconductor investment is shifting from front-end to back-end and packaging-focused processes. Global companies are concentrating on HBM…
2026.08.28 by 배종인 기자
.jpg)
Next-generation semiconductor technology at a glance, from package substrates to neuromorphic devices… 2026 Semiconductor Business Performance Exchange Meeting
The Ministry of Science and ICT held the '2026 Semiconductor Business Achievement Exchange Meeting' at Paradise Hotel Busan from the 13th to the 14th.…
2026.07.13 by 배종인 기자
Henkel, “Supporting Semiconductor Innovation with Advanced Electronic Materials Beyond Adhesives”
Global adhesive technology company Henkel is accelerating the expansion of its electronic materials business, including semiconductors, by positioning…
2026.06.16 by 배종인 기자
SEMI Reports $36.5 Billion in Global Semiconductor Equipment Sales in Q1… Highest Quarterly Record
According to SEMI's tally, global semiconductor equipment sales for the first quarter of 2026 reached $36.55 billion, representing a 14% increase year…
2026.06.08 by 명세환 기자
.jpg)
Air Liquide Signs Gas Supply Contract with SK Hynix for HBM Semiconductor Process
Industrial gas company Air Liquide has signed a long-term contract with SK Hynix for the supply of semiconductor process gases. The agreement includes…
2026.06.04 by 배종인 기자
ACM Ships First SiCN Deposition Equipment… Expanding Support for Advanced BEOL and Packaging Processes
ACM Research shipped its first PECVD SiCN system targeting advanced semiconductor back-end-of-line and packaging processes to a major semiconductor ma…
2026.05.20 by 명세환 기자
SEMI: “Semiconductor materials market reaches $73.2 billion… all-time high”
SEMI announced that global semiconductor materials market revenue reached a record high of $73.2 billion in 2025. Both wafer fab materials and packagi…
2026.05.13 by 배종인 기자
SEMI “Global Semiconductor Equipment Sales to Increase by 15% by 2025”
SEMI announced that global semiconductor equipment sales in 2025 reached $135.1 billion, representing a 15% increase compared to the previous year. Th…
2026.04.08 by 배종인 기자
Samsung Electronics Unveils Next-Generation HBM4E at NVIDIA GTC… Highlighting Competitiveness as an AI Memory 'Total Solution'
Samsung Electronics participated in Nvidia GTC 2026, showcasing a memory integration strategy encompassing next-generation high-bandwidth memory (HBM)…
2026.03.17 by 배종인 기자
Semiconductor Competitiveness in the AI Era Shifts to 'Execution Speed and Yield-Centric Capabilities'
The investment paradigm in the semiconductor industry is shifting due to expanding AI demand. AI is driving investment focused on memory and advanced …
2026.02.23 by 명세환 기자
.jpg)
SK Hynix Invests in New Advanced Packaging Fab P&T7 in Cheongju
Global semiconductor company SK Hynix is making a new investment in an advanced packaging fab, P&T7, in Cheongju, North Chungcheong Province, to respo…
2026.01.13 by 명세환 기자
Professor Kim Seong-dong of Seoul National University of Science and Technology: "'Optical Packaging' is a rapidly emerging key technology that addresses AI data transfer limitations."
Professor Kim Sung-dong from Seoul National University of Science and Technology presented on "Trends in Advanced Packaging Technology" at the "2025 2…
2025.12.19 by 배종인 기자
Securing Next-Generation Optical Packaging Technology Depends on Interest and Talent Development
The Next-Generation Intelligent Semiconductor Business Division (Director Kim Hyung-jun) and Seoul National University of Science and Technology hoste…
2025.12.19 by 배종인 기자
.jpg)
"Advanced packaging semiconductors are rapidly emerging as game-changers"… Sharing domestic research results.
The Ministry of Science and Technology (Minister Bae Gyeong-hoon) and the National Research Foundation of Korea (President Hong Won-hwa) held the "202…
2025.10.29 by 배종인 기자
Keysight EDA Accelerates High-Performance Packaging Innovation for AI and Data Centers
Keysight Technologies is collaborating with Intel Foundry to support EMIB-T (Embedded Multi-die Interconnect Bridge-T), a next-generation high-perform…
2025.08.13 by 명세환 기자