Semiconductor investment momentum shifts from front-end to back-end
Published2026.08.28 16:38The flow of semiconductor investment is shifting from front-end to back-end and packaging-focused processes. Global companies are concentrating on HBM stacking, testing, and supply chain localization, similar to SK Hynix's Indiana HBM packaging factory, with back-end equipment and packaging industries expected to reach peak demand by 2027.
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